{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,13]],"date-time":"2026-01-13T04:00:16Z","timestamp":1768276816950,"version":"3.49.0"},"reference-count":36,"publisher":"MDPI AG","issue":"8","license":[{"start":{"date-parts":[[2025,4,9]],"date-time":"2025-04-09T00:00:00Z","timestamp":1744156800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>The traditional hot-dip tinning processes face challenges in controlling excessive copper dissolution and interfacial instability. This study involved designing a dissolution experiment using the hot-dip tin plating process. Through microscopic characterization and dissolution kinetics analysis, it systematically revealed the regulatory mechanism of trace Ni addition (0\u20130.5 wt.%) on the dissolution behavior and interfacial reaction of copper wire in a tin alloy melt. The experiment showed that Ni atoms formed a (Cu1\u2212x,Nix)6Sn5 ternary phase by replacing Cu in the Cu6Sn5 lattice, resulting in a transformation of the grain morphology of the IMC layer from equiaxed to fibrous. At the same time, the addition of Ni changed the kinetics of the interfacial reaction, effectively increasing the activation energy from 40.84 kJ\/mol in the pure Sn system to 54.21 kJ\/mol in the Sn-0.5Ni system, which extended the complete dissolution time of the copper wire at 573 K by three times.<\/jats:p>","DOI":"10.3390\/ma18081714","type":"journal-article","created":{"date-parts":[[2025,4,9]],"date-time":"2025-04-09T07:49:02Z","timestamp":1744184942000},"page":"1714","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Effect of Ni Content on the Dissolution Behavior of Hot-Dip Tin-Coated Copper Wire and the Evolution of a Cu\u2013Sn Intermetallic Compound Layer"],"prefix":"10.3390","volume":"18","author":[{"given":"Qi","family":"Wang","sequence":"first","affiliation":[{"name":"Faculty of Materials Metallurgy and Chemistry, Jiangxi University of Science and Technology, Ganzhou 341000, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-5378-3858","authenticated-orcid":false,"given":"Jinhan","family":"Zhang","sequence":"additional","affiliation":[{"name":"Faculty of Materials Metallurgy and Chemistry, Jiangxi University of Science and Technology, Ganzhou 341000, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Song","family":"Niu","sequence":"additional","affiliation":[{"name":"Anhui Xinke New Materials Co., Ltd., Wuhu 241000, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jinjin","family":"Fan","sequence":"additional","affiliation":[{"name":"Anhui Xinke New Materials Co., Ltd., Wuhu 241000, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shijun","family":"Tang","sequence":"additional","affiliation":[{"name":"Jiangxi Jinyi Nonferrous Metals Co., Ltd., Yingtan 335000, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shihong","family":"Tang","sequence":"additional","affiliation":[{"name":"Jiangxi Jinyi Nonferrous Metals Co., Ltd., Yingtan 335000, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ningkang","family":"Yin","sequence":"additional","affiliation":[{"name":"Faculty of Materials Metallurgy and Chemistry, Jiangxi University of Science and Technology, Ganzhou 341000, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jingxuan","family":"Liu","sequence":"additional","affiliation":[{"name":"Faculty of Materials Metallurgy and Chemistry, Jiangxi University of Science and Technology, Ganzhou 341000, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mingmao","family":"Li","sequence":"additional","affiliation":[{"name":"Faculty of Materials Metallurgy and Chemistry, Jiangxi University of Science and Technology, Ganzhou 341000, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2025,4,9]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"7169","DOI":"10.1016\/j.jmrt.2024.11.107","article-title":"Study on microstructure control of copper-tin biphase interface in hot-dip tin-plated electronic copper strip","volume":"33","author":"Ouyang","year":"2024","journal-title":"J. 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