{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,29]],"date-time":"2026-07-29T13:17:51Z","timestamp":1785331071258,"version":"3.55.0"},"reference-count":35,"publisher":"MDPI AG","issue":"21","license":[{"start":{"date-parts":[[2025,10,31]],"date-time":"2025-10-31T00:00:00Z","timestamp":1761868800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Wroc\u0142aw University of Science and Technology Faculty of Electronics, Photonics and Microsystems"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>This article describes the preparation of thermal interface materials (TIMs) based on silver microparticles and gold nanoparticles, fabricated via low-temperature sintering, and evaluates their mechanical and thermal properties. The characterization involved several techniques, including shear strength testing, metallographic analysis, and thermal resistance measurements. A comparative analysis of the key material properties, namely thermal and mechanical performance, was conducted. The results identify the 2:1 LC formulation\u2014comprising silver microparticles, gold nanoparticles, glycol, and ethanol at a weight ratio of 2:0.01:7:5\u2014as the most effective among the tested TIMs. Furthermore, a positive correlation between increased sintering temperature and enhanced mechanical properties was observed.<\/jats:p>","DOI":"10.3390\/ma18214981","type":"journal-article","created":{"date-parts":[[2025,11,3]],"date-time":"2025-11-03T17:32:01Z","timestamp":1762191121000},"page":"4981","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Ag Microparticle\/Au Nanoparticle Thermal Interface Materials Sintered at Low Temperature and Pressure"],"prefix":"10.3390","volume":"18","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0018-4711","authenticated-orcid":false,"given":"Krzysztof","family":"Stojek","sequence":"first","affiliation":[{"name":"Faculty of Electronics, Photonics and Microsystems, Wroc\u0142aw University of Science and Technlogy, Wyb. Wyspia\u0144skiego 27, 50-370 Wroc\u0142aw, Poland"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-8024-4896","authenticated-orcid":false,"given":"Adam Krzysztof","family":"Nowak","sequence":"additional","affiliation":[{"name":"Faculty of Electronics, Photonics and Microsystems, Wroc\u0142aw University of Science and Technlogy, Wyb. Wyspia\u0144skiego 27, 50-370 Wroc\u0142aw, Poland"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8740-6817","authenticated-orcid":false,"given":"Olga","family":"Rac-Rumijowska","sequence":"additional","affiliation":[{"name":"Faculty of Electronics, Photonics and Microsystems, Wroc\u0142aw University of Science and Technlogy, Wyb. Wyspia\u0144skiego 27, 50-370 Wroc\u0142aw, Poland"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4982-7407","authenticated-orcid":false,"given":"Mateusz","family":"Czok","sequence":"additional","affiliation":[{"name":"Faculty of Electronics, Photonics and Microsystems, Wroc\u0142aw University of Science and Technlogy, Wyb. Wyspia\u0144skiego 27, 50-370 Wroc\u0142aw, Poland"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0312-4431","authenticated-orcid":false,"given":"Damian","family":"Nowak","sequence":"additional","affiliation":[{"name":"Faculty of Electronics, Photonics and Microsystems, Wroc\u0142aw University of Science and Technlogy, Wyb. Wyspia\u0144skiego 27, 50-370 Wroc\u0142aw, Poland"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4301-8505","authenticated-orcid":false,"given":"Przemys\u0142aw","family":"Matkowski","sequence":"additional","affiliation":[{"name":"Faculty of Electronics, Photonics and Microsystems, Wroc\u0142aw University of Science and Technlogy, Wyb. Wyspia\u0144skiego 27, 50-370 Wroc\u0142aw, Poland"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2025,10,31]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Tummala, R.R. (2019). Moore\u2019s Law for Packaging to Replace Moore\u2019s Law for ICS. 2019 Pan Pacific Microelectronics Symposium (Pan Pacific), IEEE.","DOI":"10.23919\/PanPacific.2019.8696409"},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Li, Y., and Goyal, D. 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