{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,15]],"date-time":"2025-11-15T05:20:05Z","timestamp":1763184005051,"version":"3.45.0"},"reference-count":34,"publisher":"MDPI AG","issue":"22","license":[{"start":{"date-parts":[[2025,11,13]],"date-time":"2025-11-13T00:00:00Z","timestamp":1762992000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"crossref","award":["62574062"],"award-info":[{"award-number":["62574062"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"crossref"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>In this study, the stress\u2013strain constitutive models of Cu-Cu joints in hybrid bonding after primary and secondary annealing were determined using nanoindentation experiments and finite element inverse analysis, and the correlation mechanism between the microstructure and macroscopic mechanical properties in hybrid bonding Cu-Cu joints during secondary annealing was revealed. The 350\u2013400 \u00b0C secondary annealing facilitates recrystallization\u2013grain growth, increasing grain size from 0.62 \u03bcm after primary annealing to 0.71 \u03bcm, accompanied by a 12% reduction in kernel average misorientation (KAM) values. This process enhances interface non-planarization and optimizes bonding quality. Concurrently, the secondary annealed Cu-Cu joints exhibit a softening effect, manifested by decreasing trends in elastic modulus (131.02 \u2192 118.98 GPa), hardness (1.78 \u2192 1.51 GPa), and yield strength (70.52 \u2192 56.12 MPa), primarily attributed to the Hall\u2013Petch effect and residual stress release. Notably, the yield strength of secondary annealed Cu-Cu joints demonstrates 31.0% and 68.5% enhancements compared to TSV-Cu (42.83 MPa) and bulk Cu (33.3 MPa), respectively.<\/jats:p>","DOI":"10.3390\/ma18225152","type":"journal-article","created":{"date-parts":[[2025,11,13]],"date-time":"2025-11-13T12:57:13Z","timestamp":1763038633000},"page":"5152","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Constitutive Model of Secondary Annealing Behavior of Cu-Cu Joints in Cu\/SiO2 Hybrid Bonding"],"prefix":"10.3390","volume":"18","author":[{"given":"Yiming","family":"Hao","sequence":"first","affiliation":[{"name":"Institute of Electronics Packing Technology and Reliability, Beijing University of Technology, Beijing 100124, China"},{"name":"Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511300, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Si","family":"Chen","sequence":"additional","affiliation":[{"name":"Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511300, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chao","family":"Li","sequence":"additional","affiliation":[{"name":"Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511300, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zejian","family":"Chen","sequence":"additional","affiliation":[{"name":"Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511300, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fei","family":"Qin","sequence":"additional","affiliation":[{"name":"Institute of Electronics Packing Technology and Reliability, Beijing University of Technology, Beijing 100124, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0696-9018","authenticated-orcid":false,"given":"Pei","family":"Chen","sequence":"additional","affiliation":[{"name":"Institute of Electronics Packing Technology and Reliability, Beijing University of Technology, Beijing 100124, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Renjie","family":"Tian","sequence":"additional","affiliation":[{"name":"National Center for Advanced Packaging Co., Ltd., Wuxi 214112, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3578-3741","authenticated-orcid":false,"given":"Ziyang","family":"Li","sequence":"additional","affiliation":[{"name":"Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 511300, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2025,11,13]]},"reference":[{"key":"ref_1","first-page":"190","article-title":"Advances in Hybrid Bonding Technology for 3D Stacked Packages","volume":"48","author":"Zhao","year":"2023","journal-title":"Semicond. 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