{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,16]],"date-time":"2026-04-16T20:45:11Z","timestamp":1776372311677,"version":"3.51.2"},"reference-count":49,"publisher":"MDPI AG","issue":"2","license":[{"start":{"date-parts":[[2026,1,13]],"date-time":"2026-01-13T00:00:00Z","timestamp":1768262400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100004607","name":"Natural Science Foundation of Guangxi","doi-asserted-by":"publisher","award":["2025GXNSFBA069011"],"award-info":[{"award-number":["2025GXNSFBA069011"]}],"id":[{"id":"10.13039\/501100004607","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004607","name":"Natural Science Foundation of Guangxi","doi-asserted-by":"publisher","award":["2025GXNSFDA02850006"],"award-info":[{"award-number":["2025GXNSFDA02850006"]}],"id":[{"id":"10.13039\/501100004607","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U2441249"],"award-info":[{"award-number":["U2441249"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52465037"],"award-info":[{"award-number":["52465037"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Project for Enhancing Young and Middle aged Teacher\u2019s Research Basis Ability in Colleges of Guangxi","award":["2024KY0220"],"award-info":[{"award-number":["2024KY0220"]}]},{"name":"Anhui Postdoctoral Scientific Research Program Foundation","award":["2025C1116"],"award-info":[{"award-number":["2025C1116"]}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","award":["2025M774389"],"award-info":[{"award-number":["2025M774389"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology","award":["22-35-4-8012"],"award-info":[{"award-number":["22-35-4-8012"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>Liquid gallium (Ga) enables low-temperature transient liquid phase bonding (TLPB), but optimizing microstructure and joint performance remains challenging. Here, we developed a copper (Cu)-powder\/liquid-Ga composite paste for Cu\/Cu interconnects and systematically studied the effects on the interconnect joint performance of Cu powder particle size (CuPS, 10\u201320, 20\u201330 and 30\u201340 \u03bcm) and Cu mass fraction (CuMF, 10\u201330 wt%). The microstructure, electrical conductivity, and shear strength of the joint were evaluated, followed by an assessment of bonding temperature, pressure, and time. Under bonding conditions of 220 \u00b0C, 5 MPa and 720 min, a dense intermetallic compound (IMC) microstructure predominantly composed of Cu9Ga4 and CuGa2 was formed, yielding an electrical conductivity of approximately 1.1 \u00d7 107\u2009 S\u00b7m\u22121 and a shear strength of 52.2 MPa, thereby achieving a synergistic optimization of electrical and mechanical properties; even under rapid bonding conditions of 220 \u00b0C, 5 MPa and 1 min, the joint still attained a shear strength of 39.2 MPa, demonstrating the potential of this process for high-efficiency, short-time interconnection applications. These results show that adjusting the composite paste formulation and dosage enables Cu\u2013Ga TLPB joints that combine high conductivity with robust mechanical integrity for advanced packaging.<\/jats:p>","DOI":"10.3390\/ma19020314","type":"journal-article","created":{"date-parts":[[2026,1,13]],"date-time":"2026-01-13T11:42:58Z","timestamp":1768304578000},"page":"314","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Study on Microstructure and Properties of Micron Copper Powder-Liquid Metal Gallium Composite Interconnect Joint"],"prefix":"10.3390","volume":"19","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-4484-2106","authenticated-orcid":false,"given":"Bo","family":"Wang","sequence":"first","affiliation":[{"name":"East China Institute of Photo-Electron IC, Bengbu 233000, China"},{"name":"Guangxi Key Laboratory of Advanced Packaging and System Integration, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Siliang","family":"He","sequence":"additional","affiliation":[{"name":"Guangxi Key Laboratory of Advanced Packaging and System Integration, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China"},{"name":"Research Institute of Sun Yat-sen University in Huizhou, Huizhou 516081, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Guopei","family":"Zhang","sequence":"additional","affiliation":[{"name":"Goertek Inc., Weifang 261000, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Menghao","family":"Liu","sequence":"additional","affiliation":[{"name":"Guangxi Key Laboratory of Advanced Packaging and System Integration, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kaixuan","family":"He","sequence":"additional","affiliation":[{"name":"East China Institute of Photo-Electron IC, Bengbu 233000, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Huang","sequence":"additional","affiliation":[{"name":"Guangxi Key Laboratory of Advanced Packaging and System Integration, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kailin","family":"Pan","sequence":"additional","affiliation":[{"name":"Guangxi Key Laboratory of Advanced Packaging and System Integration, School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2026,1,13]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"101701","DOI":"10.1016\/j.xcrp.2023.101701","article-title":"3D Interconnects for III-V Semiconductor Heterostructures for Miniaturized Power Devices","volume":"4","author":"Lafontaine","year":"2023","journal-title":"Cell Rep. 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