{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,23]],"date-time":"2026-07-23T05:26:56Z","timestamp":1784784416552,"version":"3.55.0"},"reference-count":65,"publisher":"MDPI AG","issue":"3","license":[{"start":{"date-parts":[[2026,2,5]],"date-time":"2026-02-05T00:00:00Z","timestamp":1770249600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100007129","name":"Natural Science Foundation of Shandong Province","doi-asserted-by":"crossref","award":["ZR2023QE184"],"award-info":[{"award-number":["ZR2023QE184"]}],"id":[{"id":"10.13039\/501100007129","id-type":"DOI","asserted-by":"crossref"}]},{"name":"Medical Device Innovation and Entrepreneurship Community Funds of Shandong Province","award":["2023-SGTTXM-006"],"award-info":[{"award-number":["2023-SGTTXM-006"]}]},{"name":"Double First-Class Discipline Construction Fund","award":["2023SYLHY10"],"award-info":[{"award-number":["2023SYLHY10"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>Direct ink writing (DIW) has emerged as a promising method for fabricating flexible electronics. Copper nanowires are a key material for the conductive inks required for this technology. However, copper nanowires suffer from significant challenges, including low aspect ratios, poor oxidation resistance, and difficulty in printing. In this study, a liquid-phase reduction method was used to synthesize copper nanowires with a high aspect ratio (up to 2884) and excellent oxidation resistance. The conductive ink was prepared using ethylene glycol, isopropanolamine (MIPA), and ethanol as solvents. Rheological dynamics simulations were used to investigate the influence of printing parameters on ink printing accuracy, ultimately achieving precise control of the printing process. High-precision copper nanowire flexible circuits with a low resistivity of 2.11 \u03bc\u03a9\u00b7cm were fabricated under thermal sintering conditions using the DIW method. These circuits exhibited excellent adhesion, flexural behavior, and water resistance, demonstrating significant practical significance for the low-cost fabrication of high-precision flexible electronic devices.<\/jats:p>","DOI":"10.3390\/ma19030618","type":"journal-article","created":{"date-parts":[[2026,2,5]],"date-time":"2026-02-05T16:30:47Z","timestamp":1770309047000},"page":"618","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Fabrication of Copper Nanowires Highly Conductive and Flexible Circuits by Direct Ink Writing"],"prefix":"10.3390","volume":"19","author":[{"given":"Hui","family":"Guo","sequence":"first","affiliation":[{"name":"School of Materials Science and Engineering, Harbin Institute of Technology at Weihai, Weihai 264209, China"},{"name":"Comprehensive Research Center of Electronic Information Technology in the MIIT, Weihai 264209, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Haoting","family":"Huang","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Harbin Institute of Technology at Weihai, Weihai 264209, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shijian","family":"Shi","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Harbin Institute of Technology at Weihai, Weihai 264209, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Qinghua","family":"Sun","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Harbin Institute of Technology at Weihai, Weihai 264209, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jinping","family":"Sun","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Harbin Institute of Technology at Weihai, Weihai 264209, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kang","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Harbin Institute of Technology at Weihai, Weihai 264209, China"},{"name":"Harbin Institute of Technology (Weihai) Qingdao Research Institute, Qingdao 266109, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2973-8442","authenticated-orcid":false,"given":"Qiang","family":"Zhu","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Harbin Institute of Technology at Weihai, Weihai 264209, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Peng","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Harbin Institute of Technology at Weihai, Weihai 264209, China"},{"name":"Harbin Institute of Technology (Weihai) Qingdao Research Institute, Qingdao 266109, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2026,2,5]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"406","DOI":"10.1039\/D2TC03736J","article-title":"Design, Fabrication and Applications of Flexible RFID Antennas Based on Printed Electronic Materials and Technologies","volume":"11","author":"Yang","year":"2023","journal-title":"J. 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