{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,28]],"date-time":"2026-08-28T13:22:14Z","timestamp":1787923334681,"version":"build-2784847793"},"reference-count":31,"publisher":"MDPI AG","issue":"17","license":[{"start":{"date-parts":[[2026,8,28]],"date-time":"2026-08-28T00:00:00Z","timestamp":1787875200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52350321"],"award-info":[{"award-number":["52350321"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U1837208"],"award-info":[{"award-number":["U1837208"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"award":["52350321"],"award-info":[{"award-number":["52350321"]}],"id":[{"id":"https:\/\/ror.org\/01h0zpd94","id-type":"ROR","asserted-by":"publisher"}]},{"award":["U1837208"],"award-info":[{"award-number":["U1837208"]}],"id":[{"id":"https:\/\/ror.org\/01h0zpd94","id-type":"ROR","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Materials"],"abstract":"<jats:p>The electromigration (EM) reliability of line-type Sn-3.0Ag-0.5Cu (SAC305) solder joints with surface finishes of organic solderability preservatives (OSP), electroless nickel\/electroless palladium\/immersion Gold (ENEPIG), and Electroplated Ni was systematically investigated under a current density of 1.0 \u00d7 104 A\/cm2 at 150 \u00b0C. In the as-soldered state, scallop-shaped Cu6Sn5 grains formed at both interfaces of the OSP joints. In contrast, driven by the Cu-Ni interaction, (Cu,Ni)6Sn5 grains formed at both interfaces in the ENEPIG and Electroplated Ni joints, with their morphology varying with Ni content and exhibiting polyhedral, prismatic, or scallop-like shapes. When the surface finishes served as the cathode, the failure rate of the OSP joints (100%) was 1.2 times that of the ENEPIG joints (83%) and 2.0 times that of the Electroplated Ni joints (50%). Extensive dissolution of the Cu substrate caused the rapid failure of the OSP joints, whereas both Ni-P and Ni layers effectively blocked the diffusion of Cu atoms. In the ENEPIG joints, the consumption of Ni atoms transformed the amorphous Ni-P layer into a porous Ni3P layer, leading to joint failure. Electroplated Ni possesses a more stable crystalline structure and stronger atomic bonding, so more energy is required to release Ni atoms, resulting in a slower dissolution rate. Compared with the OSP joints, the EM lifetimes of the ENEPIG joints and Electroplated Ni joints were improved by 30% and 53%, respectively.<\/jats:p>","DOI":"10.3390\/ma19173655","type":"journal-article","created":{"date-parts":[[2026,8,28]],"date-time":"2026-08-28T12:27:46Z","timestamp":1787920066000},"page":"3655","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Effect of Surface Finish on Electromigration Reliability of Line-Type Sn-3.0Ag-0.5Cu Solder Joints"],"prefix":"10.3390","volume":"19","author":[{"given":"Shuai","family":"Meng","sequence":"first","affiliation":[{"name":"Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3261-9900","authenticated-orcid":false,"given":"Mingliang","family":"Huang","sequence":"additional","affiliation":[{"name":"Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2026,8,28]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"517","DOI":"10.1016\/j.microrel.2010.09.031","article-title":"Reliability challenges in 3D IC packaging technology","volume":"51","author":"Tu","year":"2011","journal-title":"Microelectron. 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