{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,20]],"date-time":"2026-03-20T22:44:52Z","timestamp":1774046692120,"version":"3.50.1"},"reference-count":15,"publisher":"MDPI AG","issue":"3","license":[{"start":{"date-parts":[[2021,3,17]],"date-time":"2021-03-17T00:00:00Z","timestamp":1615939200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>A multi-function microelectromechanical system (MEMS) with a three-axis magnetometer (MAG) and three-axis accelerometer (ACC) function was implemented with an application-specific integrated circuit (ASIC)-compatible complementary metal-oxide-semiconductor (CMOS) 0.18 \u03bcm process. The readout circuit used the nested chopper, correlated double-sampling (CDS), noise reduction method; the frequency division multiplexing method; the time-division multiplexing method; and the calibration method. Sensing was performed by exciting the MEMS three-axis magnetometer at X\/Y\/Z axes mechanical resonant frequencies of 3.77\/7.05\/7.47 kHz, respectively. A modest die-level vacuum packaging resulted in in-plane and out-of-plane mechanical quality factors of 471\u2013500 and 971\u20131000, respectively. The sensitivities of both the three-axis magnetometer with 2 mA driving current and the three-axis accelerometer were 7.1\u201310.7 uV\/uT and 58.37\u201388.87 uV\/ug. The resolutions of both the three-axis magnetometer with 2 mA driving current and three-axis accelerometer resolution were 44.06\u201387.46 nT\/\u221aHz and 5.043\u20137.5 ng\/\u221aHz. The resolution was limited by circuit noise equivalent acceleration (CNEM) and Brownian noise equivalent magnetic field (BNEM).<\/jats:p>","DOI":"10.3390\/mi12030314","type":"journal-article","created":{"date-parts":[[2021,3,17]],"date-time":"2021-03-17T21:43:31Z","timestamp":1616017411000},"page":"314","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":5,"title":["Multi-Function Microelectromechanical Systems Implementation with an ASIC Compatible CMOS 0.18 \u03bcm Process"],"prefix":"10.3390","volume":"12","author":[{"given":"Chih-Hsuan","family":"Lin","sequence":"first","affiliation":[{"name":"Department of Electronic Engineering, National Chiao Tung University, Hsinchu 300, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chao-Hung","family":"Song","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, National Chiao Tung University, Hsinchu 300, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kuei-Ann","family":"Wen","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, National Chiao Tung University, Hsinchu 300, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2021,3,17]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Kumar, V., Mahdavi, M., Guo, X., Mehdizadeh, E., and Pourkamali, S. 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