{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,24]],"date-time":"2026-10-24T14:59:12Z","timestamp":1792853952682,"version":"4.5.0"},"reference-count":17,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2022,9,13]],"date-time":"2022-09-13T00:00:00Z","timestamp":1663027200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"USM\u2019s Short Term Grant","award":["304\/CINOR\/6315371"],"award-info":[{"award-number":["304\/CINOR\/6315371"]}]}],"content-domain":{"domain":["www.mdpi.com"],"crossmark-restriction":true},"short-container-title":["Micromachines"],"abstract":"<jats:p>Face recognition is one of the most sophisticated disciplines of biometric systems. The use of VCSEL in automotive applications is one of the most recent advances. The existing VCSEL package with a diffuser on top of a lens intended for automotive applications could not satisfy the criteria of the automotive TS16949: 2009 specification because the package was harmed and developed a lens fracture during 100 thermal cycle tests. In order to complete a cycle, the temperature rises from \u221240 \u00b0C to 150 \u00b0C and then rises again from 150 \u00b0C to 260 \u00b0C. The package then needs to be tested 500 times to ensure it fits the requirements without failing in terms of appearance or functionality. To this extent, the goal of this research is to develop packaging for 1 mm2 VCSEL chips with a diffuser on top that prevents fractures or damage to the package during heat cycle testing with multiple materials. The package was created using the applications SolidWorks 2017 and AutoCAD Mechanical 2017. The ANSYS Mechanical Structural FEA Analysis program simulated all packages for mechanical stress to guarantee that all packages generated were resilient to high temperature conditions. All packages exhibit no abnormalities and are robust for various temperatures ranging from low to high. Therefore, these packaged 1 mm2 VCSEL chips with a diffuser on top provide an effective approach for the application of VCSEL suitable in high temperature conditions.<\/jats:p>","DOI":"10.3390\/mi13091513","type":"journal-article","created":{"date-parts":[[2022,9,13]],"date-time":"2022-09-13T22:37:28Z","timestamp":1663108648000},"page":"1513","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":2,"title":["A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties"],"prefix":"10.3390","volume":"13","author":[{"given":"Khairul Mohd","family":"Arshad","sequence":"first","affiliation":[{"name":"Institute of Nano Optoelectronics Research and Technology (INOR), Universiti Sains Malaysia, Sains@USM, Bayan Lepas 11900, Pulau Pinang, Malaysia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9201-1249","authenticated-orcid":false,"given":"Muhamad Mat","family":"Noor","sequence":"additional","affiliation":[{"name":"Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Pahang, Malaysia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6198-263X","authenticated-orcid":false,"given":"Asrulnizam Abd","family":"Manaf","sequence":"additional","affiliation":[{"name":"Collaborative Microelectronic Design Excellence Centre (CEDEC), Universiti Sains Malaysia, Sains@USM, Bayan Lepas 11900, Pulau Pinang, Malaysia"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hiroshi","family":"Kawarada","sequence":"additional","affiliation":[{"name":"Faculty of Science and Engineering, Waseda University, Shinjuku, Tokyo 169-8555, Japan"},{"name":"The Kagami Memorial Laboratory for Materials Science and Technology, Waseda University, 2-8-26 Nishiwaseda, Shinjuku, Tokyo 169-0051, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0875-9903","authenticated-orcid":false,"given":"Shaili","family":"Falina","sequence":"additional","affiliation":[{"name":"Collaborative Microelectronic Design Excellence Centre (CEDEC), Universiti Sains Malaysia, Sains@USM, Bayan Lepas 11900, Pulau Pinang, Malaysia"},{"name":"Faculty of Science and Engineering, Waseda University, Shinjuku, Tokyo 169-8555, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3236-3303","authenticated-orcid":false,"given":"Mohd","family":"Syamsul","sequence":"additional","affiliation":[{"name":"Institute of Nano Optoelectronics Research and Technology (INOR), Universiti Sains Malaysia, Sains@USM, Bayan Lepas 11900, Pulau Pinang, Malaysia"},{"name":"Faculty of Science and Engineering, Waseda University, Shinjuku, Tokyo 169-8555, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2022,9,13]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"000265","DOI":"10.4071\/1085-8024-2021.1.000265","article-title":"Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays","volume":"2021","author":"Dohle","year":"2021","journal-title":"Int. Symp. Microelectron."},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Moreolo, M.S., Fabrega, J.M., Nadal, L., and Vilchez, F.J. (2018, January 14\u201317). Exploring the potential of VCSEL technology for agile and high-capacity optical metro networks. Proceedings of the 22nd Conference on Optical Network Design and Modelling, ONDM, Dublin, Ireland.","DOI":"10.23919\/ONDM.2018.8396141"},{"key":"ref_3","first-page":"10","article-title":"A Comparative Study of Biometric Technologies with Reference to Human Interface","volume":"14","author":"Tripathi","year":"2011","journal-title":"Int. J. Comput. Appl."},{"key":"ref_4","first-page":"3871","article-title":"A Review on: Iris Recognition","volume":"6","author":"Sangwan","year":"2015","journal-title":"Int. J. Comput. Sci. Inf. Technol."},{"key":"ref_5","doi-asserted-by":"crossref","unstructured":"Moench, H., Frey, M., Grabherr, M., Gronenborn, S., Gudde, R., Kolb, J., Miller, M., and Weigl, A. (2017, January 1\u20132). VCSELs as light source for time-of-flight sensors. Proceedings of the Vertical-Cavity Surface-Emitting Lasers XXI, San Francisco, CA, USA.","DOI":"10.1117\/12.2249053"},{"key":"ref_6","doi-asserted-by":"crossref","unstructured":"Zhou, D., Seurin, J.-F., Xu, G., Van Leeuwen, R., Miglo, A., Wang, Q., Kovsh, A., and Ghosh, C. (2017, January 1\u20132). Progress on high-power 808nm VCSELs and applications. Proceedings of the Vertical-Cavity Surface-Emitting Lasers XXI, San Francisco, CA, USA.","DOI":"10.1117\/12.2253228"},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"2184","DOI":"10.1109\/JLT.2004.833784","article-title":"Optical data buses for automotive applications","volume":"22","author":"Kibler","year":"2004","journal-title":"J. Lightwave Technol."},{"key":"ref_8","unstructured":"(2020, June 24). [In-Depth Look] Keeping an Eye on Security: The Iris Scanner of the Galaxy Note7 Samsung 2016. Available online: https:\/\/news.samsung.com\/global\/in-depth-look-keeping-an-eye-on-security-the-iris-scanner-of-the-galaxy-note7."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1038\/s41598-017-15553-9","article-title":"High-brightness laser imaging with tunable speckle reduction enabled by electroactive micro-optic diffusers","volume":"7","author":"Farrokhi","year":"2017","journal-title":"Sci. Rep."},{"key":"ref_10","first-page":"1877","article-title":"Secure and Robust Iris Recognition using random projections and sparse representations","volume":"33","author":"Pillai","year":"2011","journal-title":"IEEE Trans. Softw. Eng."},{"key":"ref_11","first-page":"63","article-title":"A Iris Recognition Systems: Technical Overview","volume":"3","author":"Omidiora","year":"2015","journal-title":"Int. J. Res. Eng. Technol."},{"key":"ref_12","first-page":"20","article-title":"Making displays work for you","volume":"28","author":"Bastawros","year":"2012","journal-title":"Diffus. Film. Opt. Perform. LCDs"},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"156","DOI":"10.1016\/j.sna.2008.12.010","article-title":"Fabrication of gapless dual-curvature microlens as a diffuser for a LED package","volume":"150","author":"Pan","year":"2009","journal-title":"Sens. Actuators A Phys."},{"key":"ref_14","first-page":"148","article-title":"Package for side emitting LED","volume":"364\u2013366","author":"Pao","year":"2008","journal-title":"Key Eng. Mater."},{"key":"ref_15","doi-asserted-by":"crossref","unstructured":"Carson, R.F., Warren, M.E., Dacha, P., Wilcox, T., Maynard, J.G., Abell, D.J., Otis, K.J., and Lott, J.A. (2016, January 13\u201318). Progress in high-power high-speed VCSEL arrays. Proceedings of the Vertical-Cavity Surface-Emitting Lasers XX, San Francisco, CA, USA.","DOI":"10.1117\/12.2215009"},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"164","DOI":"10.1109\/TEPM.2004.843109","article-title":"The changing automotive environment: High-temperature electronics","volume":"27","author":"Johnson","year":"2004","journal-title":"IEEE Trans. Electron. Packag. Manuf."},{"key":"ref_17","doi-asserted-by":"crossref","unstructured":"Bielecki, J., Jwania, A.S., El Khatib, F., and Poorman, T. (2007, January 18\u201322). Thermal considerations for LED components in an automotive lamp. Proceedings of the Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, CA, USA.","DOI":"10.1109\/STHERM.2007.352403"}],"updated-by":[{"DOI":"10.3390\/mi16040390","type":"correction","label":"Correction","source":"publisher","updated":{"date-parts":[[2022,9,13]],"date-time":"2022-09-13T00:00:00Z","timestamp":1663027200000}}],"container-title":["Micromachines"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/2072-666X\/13\/9\/1513\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,3]],"date-time":"2025-08-03T14:05:46Z","timestamp":1754229946000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/2072-666X\/13\/9\/1513"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,9,13]]},"references-count":17,"journal-issue":{"issue":"9","published-online":{"date-parts":[[2022,9]]}},"alternative-id":["mi13091513"],"URL":"https:\/\/doi.org\/10.3390\/mi13091513","relation":{"correction":[{"id-type":"doi","id":"10.3390\/mi16040390","asserted-by":"object"}]},"ISSN":["2072-666X"],"issn-type":[{"value":"2072-666X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,9,13]]}}}