{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,19]],"date-time":"2026-09-19T16:37:11Z","timestamp":1789835831977,"version":"4.0.1"},"reference-count":35,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2022,9,17]],"date-time":"2022-09-17T00:00:00Z","timestamp":1663372800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Key Research and Development Projects in Hubei Province","award":["2020BAB068"],"award-info":[{"award-number":["2020BAB068"]}]},{"name":"Key Research and Development Projects in Hubei Province","award":["2021BAA071"],"award-info":[{"award-number":["2021BAA071"]}]},{"name":"Key Research and Development Projects in Hubei Province","award":["51775219"],"award-info":[{"award-number":["51775219"]}]},{"name":"Key Research and Development Projects in Hubei Province","award":["2021M701308"],"award-info":[{"award-number":["2021M701308"]}]},{"name":"National Natural Science Foundation of China","award":["2020BAB068"],"award-info":[{"award-number":["2020BAB068"]}]},{"name":"National Natural Science Foundation of China","award":["2021BAA071"],"award-info":[{"award-number":["2021BAA071"]}]},{"name":"National Natural Science Foundation of China","award":["51775219"],"award-info":[{"award-number":["51775219"]}]},{"name":"National Natural Science Foundation of China","award":["2021M701308"],"award-info":[{"award-number":["2021M701308"]}]},{"name":"China Postdoctoral Science Foundation","award":["2020BAB068"],"award-info":[{"award-number":["2020BAB068"]}]},{"name":"China Postdoctoral Science Foundation","award":["2021BAA071"],"award-info":[{"award-number":["2021BAA071"]}]},{"name":"China Postdoctoral Science Foundation","award":["51775219"],"award-info":[{"award-number":["51775219"]}]},{"name":"China Postdoctoral Science Foundation","award":["2021M701308"],"award-info":[{"award-number":["2021M701308"]}]},{"name":"Postdoctoral Creative Research Funding of Hubei Province","award":["2020BAB068"],"award-info":[{"award-number":["2020BAB068"]}]},{"name":"Postdoctoral Creative Research Funding of Hubei Province","award":["2021BAA071"],"award-info":[{"award-number":["2021BAA071"]}]},{"name":"Postdoctoral Creative Research Funding of Hubei Province","award":["51775219"],"award-info":[{"award-number":["51775219"]}]},{"name":"Postdoctoral Creative Research Funding of Hubei Province","award":["2021M701308"],"award-info":[{"award-number":["2021M701308"]}]},{"name":"Analytical and Testing Center of HUST","award":["2020BAB068"],"award-info":[{"award-number":["2020BAB068"]}]},{"name":"Analytical and Testing Center of HUST","award":["2021BAA071"],"award-info":[{"award-number":["2021BAA071"]}]},{"name":"Analytical and Testing Center of HUST","award":["51775219"],"award-info":[{"award-number":["51775219"]}]},{"name":"Analytical and Testing Center of HUST","award":["2021M701308"],"award-info":[{"award-number":["2021M701308"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>Interconnections are essential for integrating the packaging substrate, and defect-free copper-filling can further improve the reliability in through holes (THs). The coating properties and filling processes are mainly dominated by the interplays among additives in the direct current electroplating. The acidic copper sulfate electroplating solution contained three typical convection-dependent additives and chloride ions (Cl\u2212). The THs with aspect ratios (ARs) of 6.25, 5, and 4.17 (thickness of 500 \u03bcm) were selected as the study subjects. The effects of Cl\u2212 and ARs on the interactions among the additives were investigated in detail using electrochemical measurements, which were verified by the THs filling experiments. The additive compounds present a convection enhanced inhibition effect and cathodic polarization, leading to a copper filling capacity increase with ARs and the amelioration of copper compactness and corrosion resistance. The defect-free copper filling of THs and a uniform mirror bright surface circuit can be achieved simultaneously using compound additives at a relatively high speed.<\/jats:p>","DOI":"10.3390\/mi13091539","type":"journal-article","created":{"date-parts":[[2022,9,19]],"date-time":"2022-09-19T02:06:50Z","timestamp":1663553210000},"page":"1539","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":10,"title":["Promotion of High-Speed Copper-Filling Performance for Interconnections with Increasing Aspect-Ratio Using Compound Additives"],"prefix":"10.3390","volume":"13","author":[{"given":"Qing","family":"Wang","sequence":"first","affiliation":[{"name":"School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yang","family":"Peng","sequence":"additional","affiliation":[{"name":"School of Aerospace Engineering, Huazhong University of Science and Technology, Wuhan 430074, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yun","family":"Mou","sequence":"additional","affiliation":[{"name":"School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mingxiang","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2022,9,17]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"140218","DOI":"10.1016\/j.electacta.2022.140218","article-title":"Computational and Experiments Exploration of Convection on Cu Filling Characteristics of Multiple Aspect-Ratio Micro through-Holes","volume":"416","author":"Wang","year":"2022","journal-title":"Electrochim. 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