{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,22]],"date-time":"2026-09-22T22:02:27Z","timestamp":1790114547164,"version":"4.0.1"},"reference-count":87,"publisher":"MDPI AG","issue":"8","license":[{"start":{"date-parts":[[2023,8,16]],"date-time":"2023-08-16T00:00:00Z","timestamp":1692144000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Joint Funds of the National Natural Science Foundation of China","award":["U21A2051"],"award-info":[{"award-number":["U21A2051"]}]},{"name":"Joint Funds of the National Natural Science Foundation of China","award":["232102221017"],"award-info":[{"award-number":["232102221017"]}]},{"name":"Joint Funds of the National Natural Science Foundation of China","award":["222102230019"],"award-info":[{"award-number":["222102230019"]}]},{"name":"Joint Funds of the National Natural Science Foundation of China","award":["2GSO64-A52-05"],"award-info":[{"award-number":["2GSO64-A52-05"]}]},{"name":"Joint Funds of the National Natural Science Foundation of China","award":["NSFRF210102"],"award-info":[{"award-number":["NSFRF210102"]}]},{"name":"Joint Funds of the National Natural Science Foundation of China","award":["T2023-7"],"award-info":[{"award-number":["T2023-7"]}]},{"name":"Joint Funds of the National Natural Science Foundation of China","award":["B2015-40"],"award-info":[{"award-number":["B2015-40"]}]},{"name":"Key Science and Technology Program of Henan Province","award":["U21A2051"],"award-info":[{"award-number":["U21A2051"]}]},{"name":"Key Science and Technology Program of Henan Province","award":["232102221017"],"award-info":[{"award-number":["232102221017"]}]},{"name":"Key Science and Technology Program of Henan Province","award":["222102230019"],"award-info":[{"award-number":["222102230019"]}]},{"name":"Key Science and Technology Program of Henan Province","award":["2GSO64-A52-05"],"award-info":[{"award-number":["2GSO64-A52-05"]}]},{"name":"Key Science and Technology Program of Henan Province","award":["NSFRF210102"],"award-info":[{"award-number":["NSFRF210102"]}]},{"name":"Key Science and Technology Program of Henan Province","award":["T2023-7"],"award-info":[{"award-number":["T2023-7"]}]},{"name":"Key Science and Technology Program of Henan Province","award":["B2015-40"],"award-info":[{"award-number":["B2015-40"]}]},{"name":"Training Plan for Young Backbone Teachers in Higher Education Institutions of Henan Province","award":["U21A2051"],"award-info":[{"award-number":["U21A2051"]}]},{"name":"Training Plan for Young Backbone Teachers in Higher Education Institutions of Henan Province","award":["232102221017"],"award-info":[{"award-number":["232102221017"]}]},{"name":"Training Plan for Young Backbone Teachers in Higher Education Institutions of Henan Province","award":["222102230019"],"award-info":[{"award-number":["222102230019"]}]},{"name":"Training Plan for Young Backbone Teachers in Higher Education Institutions of Henan Province","award":["2GSO64-A52-05"],"award-info":[{"award-number":["2GSO64-A52-05"]}]},{"name":"Training Plan for Young Backbone Teachers in Higher Education Institutions of Henan Province","award":["NSFRF210102"],"award-info":[{"award-number":["NSFRF210102"]}]},{"name":"Training Plan for Young Backbone Teachers in Higher Education Institutions of Henan Province","award":["T2023-7"],"award-info":[{"award-number":["T2023-7"]}]},{"name":"Training Plan for Young Backbone Teachers in Higher Education Institutions of Henan Province","award":["B2015-40"],"award-info":[{"award-number":["B2015-40"]}]},{"name":"The Fundamental Research Funds for the Universities of Henan Province","award":["U21A2051"],"award-info":[{"award-number":["U21A2051"]}]},{"name":"The Fundamental Research Funds for the Universities of Henan Province","award":["232102221017"],"award-info":[{"award-number":["232102221017"]}]},{"name":"The Fundamental Research Funds for the Universities of Henan Province","award":["222102230019"],"award-info":[{"award-number":["222102230019"]}]},{"name":"The Fundamental Research Funds for the Universities of Henan Province","award":["2GSO64-A52-05"],"award-info":[{"award-number":["2GSO64-A52-05"]}]},{"name":"The Fundamental Research Funds for the Universities of Henan Province","award":["NSFRF210102"],"award-info":[{"award-number":["NSFRF210102"]}]},{"name":"The Fundamental Research Funds for the Universities of Henan Province","award":["T2023-7"],"award-info":[{"award-number":["T2023-7"]}]},{"name":"The Fundamental Research Funds for the Universities of Henan Province","award":["B2015-40"],"award-info":[{"award-number":["B2015-40"]}]},{"name":"Innovative Research Team of Henan Polytechnic University","award":["U21A2051"],"award-info":[{"award-number":["U21A2051"]}]},{"name":"Innovative Research Team of Henan Polytechnic University","award":["232102221017"],"award-info":[{"award-number":["232102221017"]}]},{"name":"Innovative Research Team of Henan Polytechnic University","award":["222102230019"],"award-info":[{"award-number":["222102230019"]}]},{"name":"Innovative Research Team of Henan Polytechnic University","award":["2GSO64-A52-05"],"award-info":[{"award-number":["2GSO64-A52-05"]}]},{"name":"Innovative Research Team of Henan Polytechnic University","award":["NSFRF210102"],"award-info":[{"award-number":["NSFRF210102"]}]},{"name":"Innovative Research Team of Henan Polytechnic University","award":["T2023-7"],"award-info":[{"award-number":["T2023-7"]}]},{"name":"Innovative Research Team of Henan Polytechnic University","award":["B2015-40"],"award-info":[{"award-number":["B2015-40"]}]},{"name":"Doctoral Fund of Henan Polytechnic University","award":["U21A2051"],"award-info":[{"award-number":["U21A2051"]}]},{"name":"Doctoral Fund of Henan Polytechnic University","award":["232102221017"],"award-info":[{"award-number":["232102221017"]}]},{"name":"Doctoral Fund of Henan Polytechnic University","award":["222102230019"],"award-info":[{"award-number":["222102230019"]}]},{"name":"Doctoral Fund of Henan Polytechnic University","award":["2GSO64-A52-05"],"award-info":[{"award-number":["2GSO64-A52-05"]}]},{"name":"Doctoral Fund of Henan Polytechnic University","award":["NSFRF210102"],"award-info":[{"award-number":["NSFRF210102"]}]},{"name":"Doctoral Fund of Henan Polytechnic University","award":["T2023-7"],"award-info":[{"award-number":["T2023-7"]}]},{"name":"Doctoral Fund of Henan Polytechnic University","award":["B2015-40"],"award-info":[{"award-number":["B2015-40"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.<\/jats:p>","DOI":"10.3390\/mi14081612","type":"journal-article","created":{"date-parts":[[2023,8,16]],"date-time":"2023-08-16T09:57:02Z","timestamp":1692179822000},"page":"1612","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":44,"title":["Copper Wire Bonding: A Review"],"prefix":"10.3390","volume":"14","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9404-6717","authenticated-orcid":false,"given":"Hongliang","family":"Zhou","sequence":"first","affiliation":[{"name":"School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Andong","family":"Chang","sequence":"additional","affiliation":[{"name":"School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Junling","family":"Fan","sequence":"additional","affiliation":[{"name":"School of Chemical and Environmental Engineering, Jiaozuo University, Jiaozuo 454000, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7364-1445","authenticated-orcid":false,"given":"Jun","family":"Cao","sequence":"additional","affiliation":[{"name":"School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bin","family":"An","sequence":"additional","affiliation":[{"name":"School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jie","family":"Xia","sequence":"additional","affiliation":[{"name":"School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jingguang","family":"Yao","sequence":"additional","affiliation":[{"name":"School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaobin","family":"Cui","sequence":"additional","affiliation":[{"name":"School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yingchong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Nanjing High Speed Gear Manufacturing Co., Ltd., Nanjing 211100, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2023,8,16]]},"reference":[{"key":"ref_1","first-page":"98","article-title":"Mainstream Bonded Copper Wire Semiconductor Packaging Technology for Microelectronic Packaging","volume":"30","author":"Luo","year":"2022","journal-title":"Pract. 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Des."}],"container-title":["Micromachines"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/2072-666X\/14\/8\/1612\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,10]],"date-time":"2025-10-10T20:34:45Z","timestamp":1760128485000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/2072-666X\/14\/8\/1612"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,8,16]]},"references-count":87,"journal-issue":{"issue":"8","published-online":{"date-parts":[[2023,8]]}},"alternative-id":["mi14081612"],"URL":"https:\/\/doi.org\/10.3390\/mi14081612","relation":{},"ISSN":["2072-666X"],"issn-type":[{"value":"2072-666X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,8,16]]}}}