{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,21]],"date-time":"2026-05-21T03:49:45Z","timestamp":1779335385344,"version":"3.51.4"},"reference-count":30,"publisher":"MDPI AG","issue":"10","license":[{"start":{"date-parts":[[2025,10,20]],"date-time":"2025-10-20T00:00:00Z","timestamp":1760918400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Scientific Research Platforms and Projects of Guangdong Provincial Education Department","award":["2023KTSCX308"],"award-info":[{"award-number":["2023KTSCX308"]}]},{"name":"Research Projects of Guangzhou Municipal Education Bureau","award":["202431251"],"award-info":[{"award-number":["202431251"]}]},{"name":"Science and Technology Innovation Team of Guangzhou Railway Polytechnic\u2014Materials and Advanced Manufacturing Technology and Application of Key Components of High-speed Trains","award":["GTXYT2402"],"award-info":[{"award-number":["GTXYT2402"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>This study provides a comprehensive review of ultrasonic welding research in molecular dynamics simulations, encompassing the latest advancements by scholars worldwide. Compared to traditional welding methods, ultrasonic welding offers advantages such as faster processing speed, higher mechanical strength, and environmentally friendly characteristics. However, its process parameters are subject to multiple influencing factors. Molecular dynamics simulations enable the detailed visualization of material interactions and structural changes at atomic\/molecular levels during ultrasonic welding. These simulations not only predict how different process parameters affect weld quality but also facilitate the rapid identification of viable solutions, thereby reducing experimental iterations and lowering R&amp;D costs. This review delves into the core theoretical issues pertaining to ultrasonic welding, providing robust support for practical applications. Additionally, specific optimization strategies are proposed to enhance welding performance and efficiency, promoting sustainable development in related industries. Future research could focus on exploring ultrasonic welding mechanisms under complex structures and multi-component systems.<\/jats:p>","DOI":"10.3390\/mi16101185","type":"journal-article","created":{"date-parts":[[2025,10,20]],"date-time":"2025-10-20T12:27:29Z","timestamp":1760963249000},"page":"1185","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":3,"title":["Research Status of Molecular Dynamics Simulation of Metallic Ultrasonic Welding"],"prefix":"10.3390","volume":"16","author":[{"given":"Yu","family":"Hu","sequence":"first","affiliation":[{"name":"School of Locomotive and Vehicle Engineering, Guangzhou Railway Polytechnic, Guangzhou 511300, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Huan","family":"Li","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering, Yangtze University, Jingzhou 434023, China"},{"name":"State Key Laboratory of Low Carbon Catalysis and Carbon Dioxide Utilization, Wuhan 430100, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2025,10,20]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Klerk, D.N.D., Shire, T., Gao, Z., Mcbride, A.T., and Steinmann, P. (2022). A variational integrator for the Discrete Element Method. J. Comput. Phys., 462.","DOI":"10.1016\/j.jcp.2022.111253"},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Tersoff, J. (1989). Modeling solid-state chemistry: Interatomic potentials for multicomponent systems. Phys. Rev. B, 39.","DOI":"10.1103\/PhysRevB.39.5566"},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"3269","DOI":"10.1080\/14786430903260727","article-title":"Development of interatomic potentials appropriate for simulation of solid\u2013liquid interface properties in Al\u2013Mg alloys","volume":"89","author":"Mendelev","year":"2009","journal-title":"Philos. Mag."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"279","DOI":"10.1016\/0927-0256(94)90109-0","article-title":"Systematic analysis of local atomic structure combined with 3D computer graphics","volume":"2","author":"Faken","year":"1994","journal-title":"Comp. Mater. Sci."},{"key":"ref_5","first-page":"49","article-title":"Molecular dynamics simulation of diffusion behavior between the interface of Cu\/Sn","volume":"30","author":"Cheng","year":"2009","journal-title":"Trans. China Weld. Inst."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"353","DOI":"10.1016\/j.jmrt.2022.01.011","article-title":"Intrinsic dependence of welding quality and recrystallization on the surface-contacted micro-asperity scale during ultrasonic welding of Cu\u2013Cu joints","volume":"17","author":"Ma","year":"2022","journal-title":"J. Mater. Res. Technol."},{"key":"ref_7","doi-asserted-by":"crossref","unstructured":"Nazarov, A.A., Bachurin, D.V., and Ni, Z. (2022). Atomistic simulation of ultrasonic welding of copper. Metals, 12.","DOI":"10.3390\/met12122033"},{"key":"ref_8","first-page":"29","article-title":"Molecular Dyna Mics Simulation of the Uniaxial Tensile Deformation of Nanocrystalline Copper","volume":"34","author":"Wen","year":"2002","journal-title":"ACTA Mech. Sin."},{"key":"ref_9","unstructured":"Li, Y. (2009). Molecular Dynamics Study on Plastic Deformation Behavior of Bicrystal Cu. [Master\u2019s Thesis, Harbin Institute of Technology]."},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"2339","DOI":"10.1007\/s00170-021-07987-3","article-title":"Molecular dynamics simulation of interface atomic diffusion in ultrasonic metal welding: Effect of crystal orientation and sliding velocity","volume":"118","author":"Mostafavi","year":"2022","journal-title":"Int. J. Adv. Manuf. Tech."},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"2555","DOI":"10.1007\/s42243-024-01349-5","article-title":"An atomic insight into effect of grain boundary on diffusion behavior of Cu\/Al dissimilar materials undergoing ultrasonic welding","volume":"31","author":"Yang","year":"2024","journal-title":"J. Iron Steel Res. Int."},{"key":"ref_12","doi-asserted-by":"crossref","unstructured":"Van Swygenhoven, H., and Caro, A. (1996, January 2\u20135). Molecular dynamic computer simulation of elastic and plastic behavior of nanophase Ni. Proceedings of the Materials Research Society Symposium, Boston, MA, USA.","DOI":"10.1557\/PROC-457-193"},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"879","DOI":"10.1007\/s00170-019-03582-9","article-title":"Atomistic simulation of diffusion bonding of dissimilar materials undergoing ultrasonic welding","volume":"103","author":"Samanta","year":"2019","journal-title":"Int. J. Adv. Manuf. Tech."},{"key":"ref_14","doi-asserted-by":"crossref","unstructured":"Li, C., Li, D., Tao, X., Chen, H., and Ouyang, Y.F. (2014). Molecular dynamics simulation of diffusion bonding of Al\u2013Cu interface. Model. Simul. Mater. Sci. Eng., 22.","DOI":"10.1088\/0965-0393\/22\/6\/065013"},{"key":"ref_15","first-page":"102","article-title":"Molecular dynamics simulation of the effects of temperature and holding time on the interfacial diffusion properties and mechanical properties of copper\/aluminum films","volume":"48","author":"Han","year":"2019","journal-title":"Hot Process. Technol."},{"key":"ref_16","first-page":"407","article-title":"Molecular dynamics simulation of copper-aluminum diffusion welding and stretching","volume":"56","author":"Liu","year":"2007","journal-title":"Acta Phys. Sin."},{"key":"ref_17","first-page":"7","article-title":"Simulation of interfacial atomic diffusion and mechanical properties of copper\/aluminum friction stir welded joints","volume":"50","author":"Jin","year":"2024","journal-title":"J. Lanzhou Univ. Technol."},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"7551","DOI":"10.1166\/jnn.2016.12704","article-title":"Research on interface structure during nanowelding with molecular dynamics and experimental method","volume":"16","author":"Liu","year":"2016","journal-title":"J. Nanosci. Nanotechnol."},{"key":"ref_19","first-page":"1","article-title":"Diffusion welding simulation of titanium alloy based on molecular dynamics","volume":"39","author":"Zhang","year":"2018","journal-title":"Energy Chem. Ind."},{"key":"ref_20","doi-asserted-by":"crossref","unstructured":"Moon, S., Paek, J.H., Jang, Y.H., and Kang, K. (2024). Mixing behavior of Ti\u2013Al interface during the ultrasonic welding process and its welding strength: Molecular dynamics study. Heliyon, 10.","DOI":"10.1016\/j.heliyon.2024.e25116"},{"key":"ref_21","unstructured":"Song, C. (2020). Microstructure and Properties of Low Energy Ultrasonic Welding Copper-Aluminum Joints Induced by Nanoparticles. [Master\u2019s Thesis, Harbin Institute of Technology]."},{"key":"ref_22","unstructured":"Feng, M.N. (2017). Study on the Joining Mechanism and Strengthening Technology of Magnesium\/Aluminum Dissimilar Metal Ultrasonic Welded Joints. [Ph.D. Thesis, Tianjin University]."},{"key":"ref_23","doi-asserted-by":"crossref","first-page":"395","DOI":"10.1016\/j.vacuum.2005.07.002","article-title":"Investigation of interfacial structure of Mg\/Al vacuum diffusion-bonded joint","volume":"80","author":"Liu","year":"2006","journal-title":"Vacuum"},{"key":"ref_24","first-page":"36","article-title":"Molecular dynamics simulation of atomic diffusion behavior at Fe\/W diffusion welding interface","volume":"54","author":"Song","year":"2024","journal-title":"Electr. Weld. Mach."},{"key":"ref_25","doi-asserted-by":"crossref","unstructured":"Yang, J.W., Zhang, J., and Qiao, J. (2019). Molecular dynamics simulations of atomic diffusion during the Al\u2013Cu ultrasonic welding process. Materials, 12.","DOI":"10.3390\/ma12142306"},{"key":"ref_26","doi-asserted-by":"crossref","unstructured":"Ma, Q.C., Song, C., Zhou, J.L., Zhang, L., and Ji, H.J. (2021). Dynamic Weld evolution during ultrasonic welding of Cu\u2013Al joints. Mater. Sci. Eng. A, 823.","DOI":"10.1016\/j.msea.2021.141724"},{"key":"ref_27","first-page":"2272","article-title":"Nanowelding Technology Study Based on Simulation Methods","volume":"275","author":"Liu","year":"2013","journal-title":"Appl. Mech. Mater."},{"key":"ref_28","unstructured":"Mostafavi, S., Patil, S.P., and Markert, B. (2019, January 3\u20135). A molecular dynamics study of the interface temperature in ultrasonic metal welding. Proceedings of the 8th International Conference on Computational Methods for Coupled Problems in Science and Engineering (COUPLED), Sitges, Spain."},{"key":"ref_29","doi-asserted-by":"crossref","first-page":"1135","DOI":"10.1016\/j.scriptamat.2005.02.004","article-title":"Molecular dynamics modeling of diffusion bonding","volume":"52","author":"Chen","year":"2005","journal-title":"Scr. Mater."},{"key":"ref_30","doi-asserted-by":"crossref","unstructured":"Long, Y.Y., He, B., Cui, W.Z., Ji, Y.H., Zhuang, X.Y., and Twiefel, J. (2020). Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation. Mater. Des., 192.","DOI":"10.1016\/j.matdes.2020.108718"}],"container-title":["Micromachines"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/2072-666X\/16\/10\/1185\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,20]],"date-time":"2025-10-20T12:50:30Z","timestamp":1760964630000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/2072-666X\/16\/10\/1185"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,10,20]]},"references-count":30,"journal-issue":{"issue":"10","published-online":{"date-parts":[[2025,10]]}},"alternative-id":["mi16101185"],"URL":"https:\/\/doi.org\/10.3390\/mi16101185","relation":{},"ISSN":["2072-666X"],"issn-type":[{"value":"2072-666X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,10,20]]}}}