{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,21]],"date-time":"2026-09-21T20:42:14Z","timestamp":1790023334398,"version":"4.0.1"},"reference-count":31,"publisher":"MDPI AG","issue":"12","license":[{"start":{"date-parts":[[2025,12,18]],"date-time":"2025-12-18T00:00:00Z","timestamp":1766016000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Jilin Province Scientific and Technological Development Program","award":["YDZJ202301ZYTS262"],"award-info":[{"award-number":["YDZJ202301ZYTS262"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>Carbon fiber reinforced silicon carbide (C\/SiC) composite material exhibits exceptional properties, including high strength, high stiffness, low density, outstanding high-temperature performance, and corrosion resistance. Consequently, they are widely used in aerospace, defense, and automotive engineering. However, their anisotropic, high hardness, and brittle characteristics make them a typical difficult-to-machine material. This paper focuses on achieving high-quality micro hole machining of C\/SiC composite material via electrical discharge machining. It systematically investigates electrical discharge machining characteristics and innovatively develops a hollow internal flow helical electrode reaming process. Experimental results reveal four typical chip morphologies: spherical, columnar, blocky, and molten. The study uncovers a multi-mechanism cutting process: the EDM ablation of the composite involves material melting and explosive vaporization, the intact extraction and fracture of carbon fibers, and the brittle fracture and spalling of the SiC matrix. Discharge energy correlates closely with surface roughness: higher energy removes more SiC, resulting in greater roughness, while lower energy concentrates on m fibers, yielding higher vaporization rates. C fiber orientation significantly impacts removal rates: processing time is shortest at \u03b8 = 90\u00b0, longest at \u03b8 = 0\u00b0, and increases as \u03b8 decreases. Typical defects such as delamination were observed between alternating 0\u00b0 and 90\u00b0 fiber bundles or at hole entrances. Cracks were also detected at the SiC matrix\u2013C fiber interface. The proposed hole-enlargement process enhances chip removal efficiency through its helical structure and internal flushing, reduces abnormal discharges, mitigates micro hole taper, and thereby improves forming quality. This study provides practical references for the EDM of C\/SiC composite material.<\/jats:p>","DOI":"10.3390\/mi16121423","type":"journal-article","created":{"date-parts":[[2025,12,18]],"date-time":"2025-12-18T13:45:07Z","timestamp":1766065507000},"page":"1423","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":4,"title":["Research on Machining Characteristics of C\/SiC Composite Material by EDM"],"prefix":"10.3390","volume":"16","author":[{"given":"Peng","family":"Yu","sequence":"first","affiliation":[{"name":"Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130022, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-6629-5775","authenticated-orcid":false,"given":"Ziyang","family":"Yu","sequence":"additional","affiliation":[{"name":"Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130022, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lize","family":"Wang","sequence":"additional","affiliation":[{"name":"Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130022, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yongcheng","family":"Gao","sequence":"additional","affiliation":[{"name":"Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130022, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Qiang","family":"Li","sequence":"additional","affiliation":[{"name":"Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130022, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7267-5363","authenticated-orcid":false,"given":"Yiquan","family":"Li","sequence":"additional","affiliation":[{"name":"Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130022, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2025,12,18]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Park, M.S., Gu, J., Lee, H., Feng, L., and Fahrenholtz, W.G. 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