{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,27]],"date-time":"2026-03-27T14:05:21Z","timestamp":1774620321672,"version":"3.50.1"},"reference-count":21,"publisher":"MDPI AG","issue":"4","license":[{"start":{"date-parts":[[2026,3,27]],"date-time":"2026-03-27T00:00:00Z","timestamp":1774569600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Jiangsu Government Scholarship for Overseas Studies","award":["JS-2024-7"],"award-info":[{"award-number":["JS-2024-7"]}]},{"name":"natural science research projects of Jiangsu Universities","award":["18KJA4600050"],"award-info":[{"award-number":["18KJA4600050"]}]},{"name":"natural science research projects of Jiangsu Universities","award":["21KJB460010"],"award-info":[{"award-number":["21KJB460010"]}]},{"name":"high-level talent project of \u201csix talent peaks\u201d in Jiangsu Province","award":["GDZB-024"],"award-info":[{"award-number":["GDZB-024"]}]},{"name":"open project of National Key Laboratory of Robotics","award":["2018-016"],"award-info":[{"award-number":["2018-016"]}]},{"name":"National Natural Science Foundation of China\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t              https:\/\/ror.org\/01h0zpd94","award":["51305209"],"award-info":[{"award-number":["51305209"]}]},{"name":"Youth Science and Technology Innovation Fund of Nanjing Forestry University","award":["CX2019009"],"award-info":[{"award-number":["CX2019009"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>Acoustic microactuation technology has emerged as an effective approach for fabrication of micro- and nanoscale objects, enabling precise processing and shaping control of microscale materials by efficiently transmitting ultrasonic vibration energy and focusing energy locally. In this work, the proposed platform is regarded as an acoustically driven micromachine, in which ultrasonic excitation acts as the primary microactuation mechanism. Micrometer-scale copper wires are widely used in microelectronics and precision manufacturing. However, their small dimensions and low rigidity make fixation and forming particularly challenging. To achieve controllable forming of fine copper wires, this study introduces an ultrasonic vibration energy-focusing principle and investigates an ultrasonic post-processing method tailored for such materials, with the aim of enhancing processing stability and forming accuracy. An ultrasonic processing experimental platform for copper wires was established, and multiple micro-tool designs\u2014including glass fiber, 304 stainless steel wire with support, and elastic hard 304 stainless steel\u2014were evaluated. Single-point and continuous processing experiments were conducted by varying micro-tool materials and support configurations, and the influence of feed speed on processing width and depth was systematically analyzed. The results indicate that a hard 304 stainless steel micro-tool supported by a hard plastic ring provides the best overall performance. Feed speed has a significant effect on processing depth, with a maximum average depth of approximately 0.95 \u03bcm achieved at a feed speed of 1 mm\/min. These findings demonstrate the feasibility of ultrasonic processing for the effective forming of fine copper wires and confirm that appropriate micro-tool design and feed speed are critical for achieving stable and reliable processing results. The proposed system employs an ultrasonically actuated micro-tool to perform post-processing on micrometer-scale copper wires. The ultrasonic vibration serves as a microactuation mechanism that enhances local deformation and material response during micro-machining.<\/jats:p>","DOI":"10.3390\/mi17040411","type":"journal-article","created":{"date-parts":[[2026,3,27]],"date-time":"2026-03-27T12:45:53Z","timestamp":1774615553000},"page":"411","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["An Ultrasonic Micro-Tool Assisted Platform for Post-Processing of Micrometer-Scale Copper Wires"],"prefix":"10.3390","volume":"17","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-0680-6908","authenticated-orcid":false,"given":"Xu","family":"Wang","sequence":"first","affiliation":[{"name":"College of Mechanical and Electronic Engineering, Nanjing Forestry University, Nanjing 210037, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhiwei","family":"Xu","sequence":"additional","affiliation":[{"name":"College of Mechanical and Electronic Engineering, Nanjing Forestry University, Nanjing 210037, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chengjia","family":"Zhu","sequence":"additional","affiliation":[{"name":"College of Mechanical and Electronic Engineering, Nanjing Forestry University, Nanjing 210037, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tian","family":"Zhang","sequence":"additional","affiliation":[{"name":"College of Mechanical and Electronic Engineering, Nanjing Forestry University, Nanjing 210037, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3254-1296","authenticated-orcid":false,"given":"Qiang","family":"Tang","sequence":"additional","affiliation":[{"name":"Jiangsu Key Laboratory of Advanced Manufacturing Technology, Faculty of Mechanical and Material Engineering, Huaiyin Institute of Technology, Huaian 223003, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Junchao","family":"Zhang","sequence":"additional","affiliation":[{"name":"College of Aeronautics and Astronautics, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4574-3900","authenticated-orcid":false,"given":"Yinlong","family":"Zhu","sequence":"additional","affiliation":[{"name":"College of Mechanical and Electronic Engineering, Nanjing Forestry University, Nanjing 210037, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2026,3,27]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Lee, Y.C., Kong, M., and Zhang, Y. (2016). Microelectromechanical systems and packaging. Materials for Advanced Packaging, Springer International Publishing.","DOI":"10.1007\/978-3-319-45098-8_16"},{"key":"ref_2","doi-asserted-by":"crossref","unstructured":"Zhou, H., Chang, A., Fan, J., Cao, J., An, B., Xia, J., Yao, J., Cui, X., and Zhang, Y. (2023). Copper wire bonding: A review. Micromachines, 14.","DOI":"10.3390\/mi14081612"},{"key":"ref_3","doi-asserted-by":"crossref","unstructured":"Wang, Y., Yang, Y., Han, C., Pang, G., Fan, S., Xu, Y., He, Z., and Fang, J. (2025). Research Progress of Electrochemical Machining Technology in Surface Processing: A Review. Micromachines, 16.","DOI":"10.3390\/mi16101174"},{"key":"ref_4","first-page":"2025009","article-title":"Ultrasonic vibration-assisted micro-milling: A comprehensive review","volume":"5","author":"Ullah","year":"2025","journal-title":"J. Adv. Manuf. Sci. 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