{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,5]],"date-time":"2026-08-05T11:43:55Z","timestamp":1785930235492,"version":"3.56.0"},"reference-count":40,"publisher":"MDPI AG","issue":"8","license":[{"start":{"date-parts":[[2026,8,5]],"date-time":"2026-08-05T00:00:00Z","timestamp":1785888000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>Microgears enable mechanical power transmission, speed reduction, motion conversion, and synchronization in compact devices ranging from microelectromechanical systems to miniature robots and optically driven micromachines. Their behavior cannot, however, be inferred by geometrically scaling conventional gears alone. As size decreases, relative manufacturing errors, surface forces, friction, adhesion, environmental sensitivity, and metrological uncertainty become increasingly important, while torque capacity and stored kinetic energy decrease rapidly. This critical review integrates the design, manufacture, tribology, and system-level performance of microgears and microgear trains. It first clarifies dimensional terminology and derives the principal scaling relationships. It then compares external, internal, planetary, worm, bevel, compliant, and reconfigurable transmission architectures; evaluates silicon micromachining, electroforming, micro powder injection molding, microforming, micro-electrical discharge machining, ultrashort-pulse laser ablation, and additive microfabrication; and examines adhesion, friction, wear, lubrication, and environmental effects. Particular attention is paid to transmission efficiency, starting torque, backlash, transmission error, lifetime, and the influence of the measuring instrument on the observed response. The literature remains strongly weighted toward manufacturability and isolated components, whereas reproducible, loaded, system-level tests are comparatively scarce. On this basis, the review proposes a unified hierarchy of validation, a minimum functional test matrix, and scale-aware design indicators. The central conclusion is that successful microgear transmissions require concurrent design of geometry, process, surface condition, environment, load path, and measurement strategy.<\/jats:p>","DOI":"10.3390\/mi17080934","type":"journal-article","created":{"date-parts":[[2026,8,5]],"date-time":"2026-08-05T10:41:42Z","timestamp":1785926502000},"page":"934","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Design, Manufacturing, Tribology, and Performance of Microgears and Microgear Trains: A Critical Review of Mechanical Power Transmission at the Microscale"],"prefix":"10.3390","volume":"17","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0054-5791","authenticated-orcid":false,"given":"Ioan","family":"Doroftei","sequence":"first","affiliation":[{"name":"Mechanical Engineering, Mechatronics and Robotics Department, \u201cGheorghe Asachi\u201d Technical University of Iasi, 43 D. Mangeron Blvd, 700050 Iasi, Romania"},{"name":"Technical Sciences Academy of Romania, 26 Dacia Blvd, 030167 Bucharest, Romania"},{"name":"Academy of Romanian Scientists, 3 Ilfov, 050044 Bucharest, Romania"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Cristina-Magda","family":"Cazacu","sequence":"additional","affiliation":[{"name":"Mechanical Engineering, Mechatronics and Robotics Department, \u201cGheorghe Asachi\u201d Technical University of Iasi, 43 D. Mangeron Blvd, 700050 Iasi, Romania"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2026,8,5]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"423","DOI":"10.1109\/41.464603","article-title":"The miniaturization technologies: Past, present, and future","volume":"42","author":"Frazier","year":"1995","journal-title":"IEEE Trans. Ind. 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