{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,24]],"date-time":"2026-08-24T18:20:41Z","timestamp":1787595641537,"version":"build-2736575974"},"reference-count":9,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2026,8,24]],"date-time":"2026-08-24T00:00:00Z","timestamp":1787529600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>Integrated circuits (ICs) constitute the fundamental hardware platform for modern information technology systems, enabling critical applications such as artificial intelligence, smartphones, computing systems, robotics, aerospace technologies, and the Internet of Things [...]<\/jats:p>","DOI":"10.3390\/mi17090996","type":"journal-article","created":{"date-parts":[[2026,8,24]],"date-time":"2026-08-24T17:20:28Z","timestamp":1787592028000},"page":"996","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Editorial for the Special Issue on Recent Advances in Lithography"],"prefix":"10.3390","volume":"17","author":[{"given":"Sikun","family":"Li","sequence":"first","affiliation":[{"name":"Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China"},{"name":"University of Chinese Academy of Sciences, Beijing 100049, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yayi","family":"Wei","sequence":"additional","affiliation":[{"name":"University of Chinese Academy of Sciences, Beijing 100049, China"},{"name":"Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hanzhi","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Physics, Changchun University of Science and Technology, Changchun 130022, China"},{"name":"Zhongshan Institute of Changchun University of Science and Technology, Zhongshan 528400, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jibin","family":"He","sequence":"additional","affiliation":[{"name":"Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China"},{"name":"College of Integrated Circuits, Zhejiang University, Hangzhou 311200, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xianhao","family":"Peng","sequence":"additional","affiliation":[{"name":"Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2026,8,24]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"3134","DOI":"10.1038\/s41467-024-47478-z","article-title":"Photonic-electronic integrated circuit-based coherent LiDAR engine","volume":"15","author":"Lukashchuk","year":"2024","journal-title":"Nat. Commun."},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"1044","DOI":"10.1038\/s41467-024-45305-z","article-title":"High-efficiency reinforcement learning with hybrid architecture photonic integrated circuit","volume":"15","author":"Li","year":"2024","journal-title":"Nat. Commun."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"338","DOI":"10.1038\/s41566-022-01144-2","article-title":"Photonic-circuit-integrated titanium:sapphire laser","volume":"17","author":"Wang","year":"2023","journal-title":"Nat. Photonics"},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"699","DOI":"10.1038\/s41586-022-05004-5","article-title":"Mechanical integrated circuit materials","volume":"608","author":"Grossmann","year":"2022","journal-title":"Nature"},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"4876","DOI":"10.1038\/s41467-021-25075-8","article-title":"A non-printed integrated-circuit textile for wireless theranostics","volume":"12","author":"Yang","year":"2021","journal-title":"Nat. Commun."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"1309","DOI":"10.1126\/science.abo2631","article-title":"A photonic integrated circuit-based erbium-doped amplifier","volume":"376","author":"Liu","year":"2022","journal-title":"Science"},{"key":"ref_7","unstructured":"Moore, G.E. (1975). Progress in digital integrated electronics. Proceedings of the IEEE International Electron Devices Meeting, IEEE."},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"5823","DOI":"10.1038\/s41467-022-33644-8","article-title":"Sub-wavelength patterned pulse laser lithography for efficient fabrication of large-area metasurfaces","volume":"13","author":"Huang","year":"2022","journal-title":"Nat. Commun."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"51","DOI":"10.1038\/s41565-023-01517-w","article-title":"Ultrahigh-printing-speed photoresists for additive manufacturing","volume":"19","author":"Liu","year":"2024","journal-title":"Nat. Nanotechnol."}],"container-title":["Micromachines"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/2072-666X\/17\/9\/996\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,8,24]],"date-time":"2026-08-24T17:21:46Z","timestamp":1787592106000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/2072-666X\/17\/9\/996"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,8,24]]},"references-count":9,"journal-issue":{"issue":"9","published-online":{"date-parts":[[2026,9]]}},"alternative-id":["mi17090996"],"URL":"https:\/\/doi.org\/10.3390\/mi17090996","relation":{},"ISSN":["2072-666X"],"issn-type":[{"value":"2072-666X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,8,24]]}}}