{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,28]],"date-time":"2026-08-28T13:23:21Z","timestamp":1787923401642,"version":"build-2784847793"},"reference-count":42,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2026,8,28]],"date-time":"2026-08-28T00:00:00Z","timestamp":1787875200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Open Research Project of Engineering Research Center of Power Integrated Circuit Anhui Province","award":["ERCPZX202502"],"award-info":[{"award-number":["ERCPZX202502"]}]},{"name":"Open Research Project of Engineering Research Center of Power Integrated Circuit Anhui Province","award":["ERCPZX202401"],"award-info":[{"award-number":["ERCPZX202401"]}]},{"name":"National Innovation and Entrepreneurship Training Program for College Students","award":["s202510375073"],"award-info":[{"award-number":["s202510375073"]}]},{"name":"Industry-University Collaborative Project","award":["hxkt2024324"],"award-info":[{"award-number":["hxkt2024324"]}]},{"name":"University-level Quality Engineering: Curriculum Ideology and Politics Demonstration Course","award":["2024KCSZ02"],"award-info":[{"award-number":["2024KCSZ02"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>This paper addresses the trade-off between electromagnetic interference (EMI) and common-mode transient immunity (CMTI) performance in capacitively isolated gate drivers for high-frequency silicon carbide (SiC) applications. Starting from the fundamental architecture of on-off keying (OOK) modulation, a novel transmitter (TX) modulator architecture is proposed. The proposed architecture employs a dynamic high-frequency carrier regulation circuit to suppress electromagnetic interference caused by the fixed carrier at the spectral source, while simultaneously utilizing a dynamic substrate regulation circuit to mitigate the impact of common-mode transient interference on the TX side, thereby enhancing the overall CMTI performance. The chip is fabricated in a 0.18-\u03bcm BCD process. Simulated carrier spectrum peak attenuation across different process-temperature corners demonstrates that the attenuation ranges from 4.43 dB to 19.621 dB across the fundamental through the third harmonic components. Under the same typical process-temperature corner, the simulated CMTI reaches 220 V\/ns, which fully validates the effectiveness of the proposed architecture in both spectral peak reduction for EMI suppression and CMTI enhancement. Post-fabrication chip testing primarily focuses on output performance, with both the simulated carrier spectrum results for EMI and the CMTI being simulation-verified indicators. The measured output voltage range is 15\u201324 V; at a supply voltage of 15 V, the charging and discharging currents are 5 A and 4.5 A, respectively, and at 24 V, they are 5.7 A and 5.3 A, respectively.<\/jats:p>","DOI":"10.3390\/mi17091022","type":"journal-article","created":{"date-parts":[[2026,8,28]],"date-time":"2026-08-28T12:27:46Z","timestamp":1787920066000},"page":"1022","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["A Capacitively Coupled OOK Transmitter with 4.43 dB Simulated Carrier Spectrum Peak Reduction and Enhanced CMTI for Wide-Bandgap FET Gate Driver"],"prefix":"10.3390","volume":"17","author":[{"ORCID":"https:\/\/orcid.org\/0009-0004-3329-4591","authenticated-orcid":false,"given":"Ningye","family":"He","sequence":"first","affiliation":[{"name":"Engineering Technology Research Center of Intelligent Microsystems AnHui Province, Huangshan University, Huangshan 245021, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"writing-original-draft","vocabulary":"credit"},{"role":"writing-review-editing","vocabulary":"credit"},{"role":"funding-acquisition","vocabulary":"credit"},{"role":"visualization","vocabulary":"credit"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-3335-365X","authenticated-orcid":false,"given":"Jiahao","family":"Li","sequence":"additional","affiliation":[{"name":"College of Intelligent Robotics and Advanced Manufacturing, Fudan University, Shanghai 200433, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"methodology","vocabulary":"credit"},{"role":"writing-original-draft","vocabulary":"credit"},{"role":"visualization","vocabulary":"credit"}]},{"given":"Yongbin","family":"Huang","sequence":"additional","affiliation":[{"name":"College of Intelligent Robotics and Advanced Manufacturing, Fudan University, Shanghai 200433, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"project-administration","vocabulary":"credit"}]},{"given":"Jiucun","family":"Lu","sequence":"additional","affiliation":[{"name":"College of Intelligent Robotics and Advanced Manufacturing, Fudan University, Shanghai 200433, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"project-administration","vocabulary":"credit"}]},{"given":"Ruifang","family":"Tie","sequence":"additional","affiliation":[{"name":"Engineering Technology Research Center of Intelligent Microsystems AnHui Province, Huangshan University, Huangshan 245021, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"software","vocabulary":"credit"}]},{"given":"Danping","family":"Yang","sequence":"additional","affiliation":[{"name":"Engineering Technology Research Center of Intelligent Microsystems AnHui Province, Huangshan University, Huangshan 245021, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"data-curation","vocabulary":"credit"}]},{"given":"Ming","family":"Yang","sequence":"additional","affiliation":[{"name":"Engineering Technology Research Center of Intelligent Microsystems AnHui Province, Huangshan University, Huangshan 245021, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"formal-analysis","vocabulary":"credit"}]},{"given":"Zeyan","family":"Wu","sequence":"additional","affiliation":[{"name":"Engineering Technology Research Center of Intelligent Microsystems AnHui Province, Huangshan University, Huangshan 245021, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"validation","vocabulary":"credit"}]},{"given":"Fuwei","family":"Shen","sequence":"additional","affiliation":[{"name":"Engineering Technology Research Center of Intelligent Microsystems AnHui Province, Huangshan University, Huangshan 245021, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"investigation","vocabulary":"credit"}]},{"given":"Zhenhai","family":"Chen","sequence":"additional","affiliation":[{"name":"Engineering Technology Research Center of Intelligent Microsystems AnHui Province, Huangshan University, Huangshan 245021, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"conceptualization","vocabulary":"credit"},{"role":"methodology","vocabulary":"credit"},{"role":"supervision","vocabulary":"credit"},{"role":"writing-review-editing","vocabulary":"credit"}]},{"given":"Zongguang","family":"Yu","sequence":"additional","affiliation":[{"name":"No. 58 Research Institute, China Electronic Technology Group Corporation, Wuxi 214035, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"supervision","vocabulary":"credit"}]}],"member":"1968","published-online":{"date-parts":[[2026,8,28]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Taha, W., Nahid-Mobarakeh, B., and Bauman, J. 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