{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,8]],"date-time":"2026-09-08T09:08:28Z","timestamp":1788858508305,"version":"build-2803163510"},"reference-count":30,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2026,9,8]],"date-time":"2026-09-08T00:00:00Z","timestamp":1788825600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Basic Research Program of the Jiangsu Natural Science Foundation","award":["BK20243023"],"award-info":[{"award-number":["BK20243023"]}]},{"name":"Joint Project of the Yangtze River Delta Community of Sci-tech Innovation","award":["2023CSJGG0400"],"award-info":[{"award-number":["2023CSJGG0400"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>To address the difficulty of balancing sensitivity and nonlinearity in MEMS piezoresistive pressure sensors, this study proposes an MEMS piezoresistive pressure sensor with a narrow cross-beam membrane\u2013short beam structure. The structure introduces a tapered design at the ends of a conventional cross beam and incorporates short beams to enhance stress concentration in the sensitive regions, thereby improving output sensitivity while maintaining low nonlinearity. Finite-element analysis was performed to evaluate the stress distribution and deflection characteristics and to compare the proposed structure with conventional cross-beam and other diaphragm structures. Under identical overall dimensions, the proposed structure improves sensitivity by 61% relative to the conventional cross beam. Based on the finite-element results, multivariate fitting models for surface stress and deflection were established, and nonlinear optimization was used to determine the constrained optimal geometrical parameters within the validated design domain. Simulation results indicate that, over a pressure range of 0\u20131 kPa, the proposed sensor achieves a sensitivity of 12.23 mV\/V\/kPa and a maximum nonlinearity of 0.196% FSS, demonstrating favorable performance for micropressure detection.<\/jats:p>","DOI":"10.3390\/mi17091062","type":"journal-article","created":{"date-parts":[[2026,9,8]],"date-time":"2026-09-08T08:10:22Z","timestamp":1788855022000},"page":"1062","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["A High-Sensitivity MEMS Pressure Sensor with a Narrow Cross-Beam Membrane\u2013Short Beam Structure"],"prefix":"10.3390","volume":"17","author":[{"ORCID":"https:\/\/orcid.org\/0009-0006-5257-3793","authenticated-orcid":false,"given":"Tao","family":"Wang","sequence":"first","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai 200240, China"},{"name":"Wuxi Zhongwei Microchips Co., Ltd., Wuxi 210093, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"conceptualization","vocabulary":"credit"},{"role":"methodology","vocabulary":"credit"},{"role":"resources","vocabulary":"credit"},{"role":"writing-original-draft","vocabulary":"credit"},{"role":"formal-analysis","vocabulary":"credit"}]},{"given":"Zibang","family":"Xiao","sequence":"additional","affiliation":[{"name":"Key Laboratory of MEMS of the Ministry of Education, School of Integrated Circuits, Southeast University, Nanjing 210096, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"methodology","vocabulary":"credit"},{"role":"software","vocabulary":"credit"}]},{"given":"Peicang","family":"Chen","sequence":"additional","affiliation":[{"name":"Wuxi Zhongwei Microchips Co., Ltd., Wuxi 210093, China"},{"name":"School of Mechano-Electronic Engineering, Xidian University, Xi\u2019an 710071, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"investigation","vocabulary":"credit"},{"role":"resources","vocabulary":"credit"},{"role":"methodology","vocabulary":"credit"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3478-8508","authenticated-orcid":false,"given":"Meng","family":"Nie","sequence":"additional","affiliation":[{"name":"Key Laboratory of MEMS of the Ministry of Education, School of Integrated Circuits, Southeast University, Nanjing 210096, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"writing-review-editing","vocabulary":"credit"},{"role":"writing-original-draft","vocabulary":"credit"},{"role":"software","vocabulary":"credit"},{"role":"resources","vocabulary":"credit"}]},{"given":"Zhen","family":"Yan","sequence":"additional","affiliation":[{"name":"Key Laboratory of MEMS of the Ministry of Education, School of Integrated Circuits, Southeast University, Nanjing 210096, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"resources","vocabulary":"credit"},{"role":"conceptualization","vocabulary":"credit"},{"role":"data-curation","vocabulary":"credit"}]},{"given":"Shijie","family":"Deng","sequence":"additional","affiliation":[{"name":"Key Laboratory of MEMS of the Ministry of Education, School of Integrated Circuits, Southeast University, Nanjing 210096, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"validation","vocabulary":"credit"},{"role":"conceptualization","vocabulary":"credit"}]},{"given":"Jing","family":"Chen","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"software","vocabulary":"credit"},{"role":"formal-analysis","vocabulary":"credit"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9510-4045","authenticated-orcid":false,"given":"Xiaolin","family":"Wang","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"writing-review-editing","vocabulary":"credit"},{"role":"formal-analysis","vocabulary":"credit"}]},{"given":"Jingquan","family":"Liu","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"vocabulary":"crossref","role":"author"},{"role":"writing-review-editing","vocabulary":"credit"},{"role":"software","vocabulary":"credit"},{"role":"methodology","vocabulary":"credit"}]}],"member":"1968","published-online":{"date-parts":[[2026,9,8]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"156","DOI":"10.1038\/s41378-023-00620-1","article-title":"Advances in high-performance MEMS pressure sensors: Design, fabrication, and packaging","volume":"9","author":"Han","year":"2023","journal-title":"Microsyst. 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