{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,8]],"date-time":"2026-09-08T10:17:28Z","timestamp":1788862648452,"version":"build-2803163510"},"reference-count":100,"publisher":"MDPI AG","issue":"9","license":[{"start":{"date-parts":[[2026,9,8]],"date-time":"2026-09-08T00:00:00Z","timestamp":1788825600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Chung-Ang University Research Scholarship"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Micromachines"],"abstract":"<jats:p>Advances in artificial intelligence, high-performance computing, and generative AI technologies have driven a rapid increase in the memory bandwidth and data throughput required of semiconductor systems, establishing High Bandwidth Memory (HBM)\u2014which vertically stacks multiple DRAM dies\u2014as a key enabling memory technology. However, increasing the stack count and shrinking the interconnect pitch in HBM not only intensify vertical heat accumulation and hotspot formation but also give rise to complex reliability issues, including thermo-mechanical stress arising from coefficient-of-thermal-expansion (CTE) mismatch, package warpage, interfacial delamination, Cu protrusion, void formation, and joint degradation. This review analyzes the heat-generation and heat-transfer mechanisms of HBM packages and examines package-level thermal management strategies based on thermal interface materials, underfill, non-conductive film, epoxy molding compound, heat spreaders, and high-thermal-conductivity composites. It further summarizes the current crowding, electromigration, Cu\u2013dielectric interfacial defects, and thermo-mechanical failure mechanisms that arise at fine-pitch interconnects and hybrid-bonding interfaces, together with the material and process design strategies developed to mitigate them. In addition, structure-based thermal management technologies\u2014thermal TSVs, embedded cooling, and hybrid bonding\u2014are compared. This review emphasizes that the thermal bottlenecks and reliability degradation of HBM are interconnected through interfacial thermal resistance, interfacial adhesion, residual stress, and interfacial defects, and proposes that next-generation, highly stacked HBM requires a multi-scale thermal-reliability co-design that integrally controls the heat-, stress-, and current-transfer pathways across the entire package and interconnect domain, rather than relying on the improvement of individual material properties alone.<\/jats:p>","DOI":"10.3390\/mi17091065","type":"journal-article","created":{"date-parts":[[2026,9,8]],"date-time":"2026-09-08T10:00:04Z","timestamp":1788861604000},"page":"1065","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Thermal Management and Reliability Engineering of Advanced HBM Packages: Materials, Interfaces, and Integrated Design Strategies"],"prefix":"10.3390","volume":"17","author":[{"given":"Hye Rin","family":"Do","sequence":"first","affiliation":[{"name":"School of Integrative Engineering, Chung-Ang University, 84 Heukseok-ro, Dongjak-gu, Seoul 06974, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jun Ha","family":"Wee","sequence":"additional","affiliation":[{"name":"School of Integrative Engineering, Chung-Ang University, 84 Heukseok-ro, Dongjak-gu, Seoul 06974, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-5710-2054","authenticated-orcid":false,"given":"Hwa Rim","family":"Lee","sequence":"additional","affiliation":[{"name":"School of Integrative Engineering, Chung-Ang University, 84 Heukseok-ro, Dongjak-gu, Seoul 06974, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Young Chae","family":"Lee","sequence":"additional","affiliation":[{"name":"School of Integrative Engineering, Chung-Ang University, 84 Heukseok-ro, Dongjak-gu, Seoul 06974, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yunna","family":"Song","sequence":"additional","affiliation":[{"name":"School of Integrative Engineering, Chung-Ang University, 84 Heukseok-ro, Dongjak-gu, Seoul 06974, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4895-356X","authenticated-orcid":false,"given":"Sung Gyu","family":"Pyo","sequence":"additional","affiliation":[{"name":"School of Integrative Engineering, Chung-Ang University, 84 Heukseok-ro, Dongjak-gu, Seoul 06974, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2026,9,8]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"145","DOI":"10.4071\/imaps.1542066","article-title":"State-of-the-art and outlooks of chiplets heterogeneous integration and hybrid bonding","volume":"18","author":"Lau","year":"2021","journal-title":"J. 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