{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,12]],"date-time":"2025-10-12T02:41:11Z","timestamp":1760236871333,"version":"build-2065373602"},"reference-count":28,"publisher":"MDPI AG","issue":"1","license":[{"start":{"date-parts":[[2021,12,30]],"date-time":"2021-12-30T00:00:00Z","timestamp":1640822400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Nanomaterials"],"abstract":"<jats:p>The high thermal conductivity and good insulating properties of boron nitride (BN) make it a promising filler for high-performance polymer-based thermal management materials. An easy way to prepare BN-polymer composites is to directly mix BN particles with polymer matrix. However, a high concentration of fillers usually leads to a huge reduction of mechanical strength and optical transmission. Here, we propose a novel method to prepare polyethylene\/boron nitride nanoplates (PE\/BNNPs) composites through the combination of electrostatic self-assembly and hot pressing. Through this method, the thermal conductivity of the PE\/BNNPs composites reach 0.47 W\/mK, which gets a 14.6% improvement compared to pure polyethylene film. Thanks to the tight bonding of polyethylene with BNNPs, the tensile strength of the composite film reaches 1.82 MPa, an increase of 173.58% compared to that of pure polyethylene film (0.66 MPa). The fracture stress was also highly enhanced, with an increase of 148.44% compared to pure polyethylene film. Moreover, the addition of BNNPs in PE does not highly reduce its good transmittance, which is preferred for thermal management in devices like light-emitting diodes. This work gives an insight into the preparation strategy of transparent and flexible thermal management materials with high thermal conductivity.<\/jats:p>","DOI":"10.3390\/nano12010111","type":"journal-article","created":{"date-parts":[[2021,12,30]],"date-time":"2021-12-30T23:29:07Z","timestamp":1640906947000},"page":"111","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":2,"title":["A Novel Method to Prepare Transparent, Flexible and Thermally Conductive Polyethylene\/Boron Nitride Films"],"prefix":"10.3390","volume":"12","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-7992-6142","authenticated-orcid":false,"given":"Mingming","family":"Yi","sequence":"first","affiliation":[{"name":"School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou 510006, China"},{"name":"Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Meng","family":"Han","sequence":"additional","affiliation":[{"name":"Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0328-6898","authenticated-orcid":false,"given":"Junlin","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou 510006, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhifeng","family":"Hao","sequence":"additional","affiliation":[{"name":"School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou 510006, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuanzhou","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Chemical Engineering and Light Industry, Guangdong University of Technology, Guangzhou 510006, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yimin","family":"Yao","sequence":"additional","affiliation":[{"name":"Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rong","family":"Sun","sequence":"additional","affiliation":[{"name":"Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China"},{"name":"Shenzhen College of Advanced Technology, University of Chinese Academy of Sciences, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2021,12,30]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1016\/j.mser.2018.06.002","article-title":"Thermal conductivity of polymers and polymer nanocomposites","volume":"132","author":"Huang","year":"2018","journal-title":"Mater. 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