{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,3]],"date-time":"2026-06-03T06:51:20Z","timestamp":1780469480600,"version":"3.54.1"},"reference-count":51,"publisher":"MDPI AG","issue":"5","license":[{"start":{"date-parts":[[2022,2,27]],"date-time":"2022-02-27T00:00:00Z","timestamp":1645920000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"Ministry of Science and Technology of Republic of China (Taiwan)","award":["MOST 109-2622-E-003-006"],"award-info":[{"award-number":["MOST 109-2622-E-003-006"]}]},{"name":"Ministry of Science and Technology of Republic of China (Taiwan)","award":["MOST 107-2622-E-003-005-CC3"],"award-info":[{"award-number":["MOST 107-2622-E-003-005-CC3"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Polymers"],"abstract":"<jats:p>With the development of thin and high-power electronic devices, heat dissipation has become an important and urgent issue in thermal management. In this study, a water-based epoxy was used as a polymer matrix to prepare heat dissipation coatings utilizing low volatile organic compounds, which were environmentally friendly and had a high heat-dissipating performance. Graphene flakes, multi-walled carbon nanotubes and aluminum oxide particles were used as fillers for preparing the heat dissipation coating. The graphene flakes and multi-walled carbon nanotubes were dispersed in a water-based epoxy by adding sodium dihexyl sulfosuccinate and poly (dimethyldiallylammonium chloride). These two surfactants were combined as a dispersant to improve the dispersibility of the carbon nanomaterials in the water-based epoxy. The synergistic effect of the well-dispersed fillers improved the heat-dissipating performance. The experimental results show that the infrared emissivity of the heat dissipation film was 0.96 after filling 30 wt% aluminum oxide particles, 2 wt% graphene flakes and 2 wt% multi-walled carbon nanotubes into a water-based epoxy. The heat dissipation film reduced the thermal equilibrium temperature of the bare copper panel by 17.8 \u00b0C under a heating power of 10 W. The film was applied in a heat dissipation test on a 15 W LED bulb, and the thermal equilibrium temperature was reduced by 21.3 \u00b0C. The results demonstrate that the carbon nanomaterial-based heat dissipation coating with a water-based epoxy could significantly reduce the thermal equilibrium temperature, giving a high potential for the application of thermal management.<\/jats:p>","DOI":"10.3390\/polym14050952","type":"journal-article","created":{"date-parts":[[2022,2,27]],"date-time":"2022-02-27T20:48:33Z","timestamp":1645994913000},"page":"952","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":15,"title":["Evaluation of Surfactants on Graphene Dispersion and Thermal Performance for Heat Dissipation Coating"],"prefix":"10.3390","volume":"14","author":[{"given":"Chia","family":"Cheng","sequence":"first","affiliation":[{"name":"Department of Mechatronic Engineering, National Taiwan Normal University, No. 162, Sec. 1, He-ping E. Road, Da-an District, Taipei City 10610, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wen-Hao","family":"Shi","sequence":"additional","affiliation":[{"name":"Department of Mechatronic Engineering, National Taiwan Normal University, No. 162, Sec. 1, He-ping E. Road, Da-an District, Taipei City 10610, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tun-Ping","family":"Teng","sequence":"additional","affiliation":[{"name":"Undergraduate Program of Vehicle and Energy Engineering, National Taiwan Normal University, No. 162, Sec. 1, He-ping E. Road, Da-an District, Taipei City 10610, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8718-8813","authenticated-orcid":false,"given":"Chii-Rong","family":"Yang","sequence":"additional","affiliation":[{"name":"Department of Mechatronic Engineering, National Taiwan Normal University, No. 162, Sec. 1, He-ping E. Road, Da-an District, Taipei City 10610, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2022,2,27]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"163","DOI":"10.1016\/j.mattod.2014.04.003","article-title":"Emerging challenges and materials for thermal management of electronics","volume":"17","author":"Moore","year":"2014","journal-title":"Mater. Today"},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"1334","DOI":"10.1021\/am900200r","article-title":"Radiative Cooling: Lattice Quantization and Surface Emissivity in Thin Coatings","volume":"1","author":"Suryawanshi","year":"2009","journal-title":"ACS Appl. Mater. 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