{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,11]],"date-time":"2025-10-11T00:51:58Z","timestamp":1760143918464,"version":"build-2065373602"},"reference-count":48,"publisher":"MDPI AG","issue":"6","license":[{"start":{"date-parts":[[2024,3,7]],"date-time":"2024-03-07T00:00:00Z","timestamp":1709769600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"National Science Foundation for Excellent Young Scholars","award":["52122607","U20A20241","20220815110818001","JCYJ20210324104608024"],"award-info":[{"award-number":["52122607","U20A20241","20220815110818001","JCYJ20210324104608024"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52122607","U20A20241","20220815110818001","JCYJ20210324104608024"],"award-info":[{"award-number":["52122607","U20A20241","20220815110818001","JCYJ20210324104608024"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Shenzhen Stable Support Plan Program for Higher Education Institutions Research Program","award":["52122607","U20A20241","20220815110818001","JCYJ20210324104608024"],"award-info":[{"award-number":["52122607","U20A20241","20220815110818001","JCYJ20210324104608024"]}]},{"name":"Technology Innovation Commission of Shenzhen","award":["52122607","U20A20241","20220815110818001","JCYJ20210324104608024"],"award-info":[{"award-number":["52122607","U20A20241","20220815110818001","JCYJ20210324104608024"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Polymers"],"abstract":"<jats:p>The escalating thermal power density in electronic devices necessitates advanced thermal management technologies. Polymer-based materials, prized for their electrical insulation, flexibility, light weight, and strength, are extensively used in this field. However, the inherent low thermal conductivity of polymers requires enhancement for effective heat dissipation. This work proposes a novel paradigm, emphasizing ordered structures with functional units, to create triple-level, ordered, low-filler loading of multi-walled carbon nanotube (MWCNT)\/poly(vinyl alcohol)(PVA) nanofibrous films. By addressing interfacial thermal resistance through \u2013OH groups, the coupling between polymer and MWCNT is strengthened. The triple-level ordered structure comprises aligned PVA chains, aligned MWCNTs, and aligned MWCNT\/PVA composite fibers. Focusing on the filler\u2019s impact on thermal conductivity and chain orientation, the thermal transport mechanisms have been elucidated level by level. Our MWCNT\/PVA composite, with lower filler loadings (10 wt.%), achieves a remarkable TC exceeding 35.4 W\/(m\u00b7K), surpassing other PVA composites with filler loading below 50 wt.%.<\/jats:p>","DOI":"10.3390\/polym16060734","type":"journal-article","created":{"date-parts":[[2024,3,7]],"date-time":"2024-03-07T11:33:06Z","timestamp":1709811186000},"page":"734","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Highly Thermally Conductive Triple-Level Ordered CNT\/PVA Nanofibrous Films"],"prefix":"10.3390","volume":"16","author":[{"given":"Yanyan","family":"Wu","sequence":"first","affiliation":[{"name":"School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Anqi","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wenlong","family":"Jiang","sequence":"additional","affiliation":[{"name":"School of Innovation and Entrepreneurship, Southern University of Science and Technology, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhiye","family":"Tan","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tingting","family":"Fu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tingting","family":"Xie","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Guimei","family":"Zhu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuan","family":"Zhu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China"},{"name":"Academy for Advanced Interdisciplinary Studies, Southern University of Science and Technology, Shenzhen 518055, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2024,3,7]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"245204","DOI":"10.1088\/1361-6528\/ab0638","article-title":"Enhanced Thermal Conductivity and Lower Density Composites with Brick-Wall Microstructure Based on Highly Oriented Graphite Nanoplatelet: Towards Manufacturable Cooling Substrates for High Power Density Electronic Devices","volume":"30","author":"Zhang","year":"2019","journal-title":"Nanotechnology"},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1080\/09506608.2017.1296605","article-title":"Present and Future Thermal Interface Materials for Electronic Devices","volume":"63","author":"Razeeb","year":"2018","journal-title":"Int. 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