{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,24]],"date-time":"2026-09-24T01:13:51Z","timestamp":1790212431735,"version":"4.1.0"},"reference-count":34,"publisher":"MDPI AG","issue":"7","license":[{"start":{"date-parts":[[2024,3,28]],"date-time":"2024-03-28T00:00:00Z","timestamp":1711584000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["11902231"],"award-info":[{"award-number":["11902231"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Polymers"],"abstract":"<jats:p>To describe the evolution of residual stresses in epoxy resin during the curing process, a more detailed characterization of its viscoelastic properties is necessary. In this study, we have devised a simplified apparatus for assessing the viscoelastic properties of epoxy resin. This apparatus employs a confining cylinder to restrict the circumferential and radial deformations of the material. Following the application of load by the testing machine, the epoxy resin sample gradually reduces the gap between its surface and the inner wall of the confining cylinder, ultimately achieving full contact and establishing a continuous interface. By recording the circumferential stress\u2013strain on the outer surface of the confining cylinder, we can deduce the variations in material bulk and shear moduli with time. This characterization spans eight temperature points surrounding the glass transition temperature, revealing the bulk and shear relaxation moduli of the epoxy resin. Throughout the experiments, the epoxy resin\u2019s viscoelastic response demonstrated a pronounced time-temperature dependency. Below the glass transition temperature, the stress relaxation response progressively accelerated with increasing temperature, while beyond the glass transition temperature, the stress relaxation time underwent a substantial reduction. By applying the time-temperature superposition principle, it is possible to construct the relaxation master curves for the bulk and shear moduli of the epoxy resin. By fitting the data, we can obtain expressions for the constitutive model describing the viscoelastic behavior of the epoxy resin. In order to validate the reliability of the test results, a uniaxial tensile relaxation test was conducted on the epoxy resin casting body. The results show good agreement between the obtained uniaxial relaxation modulus curves and those derived from the bulk and shear relaxation modulus equations, confirming the validity of both the device design and the testing methodology.<\/jats:p>","DOI":"10.3390\/polym16070930","type":"journal-article","created":{"date-parts":[[2024,3,28]],"date-time":"2024-03-28T13:20:53Z","timestamp":1711632053000},"page":"930","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":7,"title":["Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model"],"prefix":"10.3390","volume":"16","author":[{"given":"Lin","family":"Yang","sequence":"first","affiliation":[{"name":"School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Anxin","family":"Ding","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mi","family":"Xu","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yuefang","family":"Li","sequence":"additional","affiliation":[{"name":"Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621999, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xianhang","family":"Zhao","sequence":"additional","affiliation":[{"name":"Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621999, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jingxuan","family":"Peng","sequence":"additional","affiliation":[{"name":"School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiang","family":"Li","sequence":"additional","affiliation":[{"name":"Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621999, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2024,3,28]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"2201023","DOI":"10.1002\/adma.202201023","article-title":"Advances on Thermally Conductive Epoxy-Based Composites as Electronic Packaging Underfill Materials\u2014A Review","volume":"34","author":"Wen","year":"2022","journal-title":"Adv. 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