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The microstructure and fracture surface were observed using a scanning electron microscope\/energy dispersive spectrometer (SEM\/EDS), and a shear test was performed on the thermally cycled joint samples. The results indicated that during the thermal cycling test, the epoxy protective layer on the surface of the epoxy-enhanced SAC305 solder joint could significantly alleviate the thermal stress caused by coefficients of thermal expansion (CTE) mismatch, resulting in fewer structural defects. The interfacial compound of the original SAC305 solder joints gradually coarsened due to the accelerated atomic diffusion, but epoxy-enhanced SAC305 solder joints demonstrated a thinner interfacial layer and a smaller IMC grain size. Due to the reduced stress concentration and the additional mechanical support provided by the cured epoxy layer, epoxy-enhanced SAC305 solder joints displayed superior shear performance compared to the original joint during the thermal cycling test. After 1000 thermal cycles, Cu-Sn IMC regions were observed on the fracture surfaces of the original SAC305 solder joint, exhibiting brittle fracture characteristics. However, the fracture of the SAC305 solder joint with 8 wt.% epoxy remained within the solder bulk and exhibited a ductile fracture mode. This work indicates that epoxy-enhanced SAC305 solder pastes display high thermal cycling reliability and could meet the design needs of advanced packaging technology for high-performance electronic packaging materials.<\/jats:p>","DOI":"10.3390\/polym16182597","type":"journal-article","created":{"date-parts":[[2024,9,16]],"date-time":"2024-09-16T07:36:00Z","timestamp":1726472160000},"page":"2597","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":12,"title":["Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint"],"prefix":"10.3390","volume":"16","author":[{"given":"Peng","family":"Zhang","sequence":"first","affiliation":[{"name":"College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China"},{"name":"Joining and Welding Research Institute, Osaka University, Ibaraki 5670047, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1546-9533","authenticated-orcid":false,"given":"Songbai","family":"Xue","sequence":"additional","affiliation":[{"name":"College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1829-8485","authenticated-orcid":false,"given":"Lu","family":"Liu","sequence":"additional","affiliation":[{"name":"Institute of Intelligent Welding and Precision Manufacturing, Shanghai Jiao Tong University, Shanghai 200240, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jianhao","family":"Wang","sequence":"additional","affiliation":[{"name":"Joining and Welding Research Institute, Osaka University, Ibaraki 5670047, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0561-3100","authenticated-orcid":false,"given":"Hiroaki","family":"Tatsumi","sequence":"additional","affiliation":[{"name":"Joining and Welding Research Institute, Osaka University, Ibaraki 5670047, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hiroshi","family":"Nishikawa","sequence":"additional","affiliation":[{"name":"Joining and Welding Research Institute, Osaka University, Ibaraki 5670047, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2024,9,14]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1016\/j.mser.2018.09.002","article-title":"Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology","volume":"136","author":"Tu","year":"2019","journal-title":"Mater. Sci. Eng. R"},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"876","DOI":"10.1080\/14686996.2019.1640072","article-title":"Reliability issues of lead-free solder joints in electronic devices","volume":"20","author":"Jiang","year":"2019","journal-title":"Sci. Technol. Adv. Mater."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"684","DOI":"10.1016\/j.microrel.2018.06.053","article-title":"Effect of Joule heating on the reliability of solder joints under power cycling conditions","volume":"88\u201390","author":"Mei","year":"2018","journal-title":"Microelectron. Reliab."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"280","DOI":"10.1016\/j.matchar.2018.12.012","article-title":"Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling","volume":"148","author":"Yang","year":"2019","journal-title":"Mater. Charact."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"1942","DOI":"10.1007\/s10854-021-07395-z","article-title":"Microstructural evolution and failure analysis of Sn\u2013Bi57\u2013Ag0.7 solder joints during thermal cycling","volume":"33","author":"Chen","year":"2022","journal-title":"J. Mater. Sci. Mater. Electron."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"125","DOI":"10.1016\/j.msea.2017.10.007","article-title":"Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock","volume":"709","author":"Tian","year":"2018","journal-title":"Mater. Sci. Eng. A"},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"341","DOI":"10.1016\/j.jallcom.2013.08.018","article-title":"Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging","volume":"582","author":"Hu","year":"2014","journal-title":"J. Alloys Compd."},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"12","DOI":"10.1016\/j.microrel.2019.05.015","article-title":"Microstructural evolution and failure mechanism of 62Sn36Pb2Ag\/Cu solder joint during thermal cycling","volume":"99","author":"Li","year":"2019","journal-title":"Microelectron. Reliab."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"110439","DOI":"10.1016\/j.matdes.2022.110439","article-title":"Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties","volume":"215","author":"Zhong","year":"2022","journal-title":"Mater. Des."},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"109224","DOI":"10.1016\/j.matdes.2020.109224","article-title":"Materials modification of the lead-free solders incorporated with micro\/nano-sized particles: A review","volume":"197","author":"Li","year":"2021","journal-title":"Mater. Des."},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"328","DOI":"10.1016\/j.msea.2016.12.089","article-title":"Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys","volume":"684","author":"Li","year":"2017","journal-title":"Mater. Sci. Eng. A"},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"145392","DOI":"10.1016\/j.msea.2023.145392","article-title":"Significant enhancement of comprehensive properties of SnBi solder through the addition of Cu@Ag core-shell particles","volume":"881","author":"Li","year":"2023","journal-title":"Mater. Sci. Eng. A"},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"138051","DOI":"10.1016\/j.msea.2019.138051","article-title":"Study of mechanical properties of Ag nanoparticle-modified graphene\/Sn-Ag-Cu solders by nanoindentation","volume":"761","author":"Han","year":"2019","journal-title":"Mater. Sci. Eng. A"},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"18563","DOI":"10.1016\/j.ceramint.2019.06.079","article-title":"Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder","volume":"45","author":"Yahaya","year":"2019","journal-title":"Ceram. Int."},{"key":"ref_15","doi-asserted-by":"crossref","first-page":"23765","DOI":"10.1016\/j.ceramint.2023.04.216","article-title":"Incorporation and corrosion protection mechanism of TiO2 nano-particles in SnAgCu composite alloys: Experimental and density functional theory study","volume":"49","author":"Choi","year":"2023","journal-title":"Ceram. Int."},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"157","DOI":"10.1016\/j.jmst.2022.01.040","article-title":"Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO2: Microstructure and mechanical properties","volume":"125","author":"Huo","year":"2022","journal-title":"J. Mater. Sci. Technol."},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"3974","DOI":"10.1016\/j.jmrt.2021.10.022","article-title":"Interfacial evolution of pure Sn solder bearing silicon carbide nanowires under isothermal aging and thermal cycling","volume":"15","author":"Li","year":"2021","journal-title":"J. Mater. Res. Technol."},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"1466","DOI":"10.1007\/s10854-024-13222-y","article-title":"Effects of Mo nanoparticles on growth of compounds layer and strength of Sn3.0Ag0.5Cu\/Cu solder joint during thermal cycling","volume":"35","author":"Ma","year":"2024","journal-title":"J. Mater. Sci. Mater. Electron."},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1016\/j.mser.2014.06.001","article-title":"Structure and properties of lead-free solders bearing micro and nano particles","volume":"82","author":"Zhang","year":"2014","journal-title":"Mater. Sci. Eng. R"},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"S411","DOI":"10.1016\/j.jallcom.2014.01.078","article-title":"Mechanical property of the epoxy-contained Sn\u201358Bi solder with OSP surface finish","volume":"615","author":"Myung","year":"2014","journal-title":"J. Alloys Compd."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"115144","DOI":"10.1016\/j.microrel.2023.115144","article-title":"Study on the properties of epoxy-based Sn58Bi solder joints","volume":"148","author":"Li","year":"2023","journal-title":"Microelectron. Reliab."},{"key":"ref_22","doi-asserted-by":"crossref","first-page":"5895","DOI":"10.1007\/s11664-016-4803-z","article-title":"Effects of aging treatment on mechanical properties of Sn-58Bi epoxy solder on ENEPIG-surface-finished PCB","volume":"45","author":"Kim","year":"2016","journal-title":"J. Electron. Mater."},{"key":"ref_23","doi-asserted-by":"crossref","first-page":"4165","DOI":"10.1007\/s11664-018-6224-7","article-title":"Mechanical reliability of the epoxy Sn-58wt.%Bi solder joints with different surface finishes under thermal shock","volume":"47","author":"Sung","year":"2018","journal-title":"J. Electron. Mater."},{"key":"ref_24","doi-asserted-by":"crossref","first-page":"795","DOI":"10.1016\/j.jallcom.2017.02.036","article-title":"Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications","volume":"704","author":"Sharma","year":"2017","journal-title":"J. Alloys Compd."},{"key":"ref_25","doi-asserted-by":"crossref","unstructured":"Liu, L., Xue, S., Ni, R., Zhang, P., and Wu, J. (2021). Study on the reliability of Sn\u2013Bi composite solder pastes with thermosetting epoxy under thermal cycling and humidity treatment. Crystals, 11.","DOI":"10.3390\/cryst11070733"},{"key":"ref_26","doi-asserted-by":"crossref","unstructured":"Zhang, P., Xue, S., Liu, L., Wu, J., Luo, Q., and Wang, J. (2022). Microstructure and shear behaviour of Sn-3.0Ag-0.5Cu composite solder pastes enhanced by epoxy resin. Polymers, 14.","DOI":"10.3390\/polym14235303"},{"key":"ref_27","doi-asserted-by":"crossref","unstructured":"Zhang, P., Xue, S.B., Liu, L., Wang, J.H., Tatsumi, H., and Nishikawa, H. (2023). Influence of isothermal aging on microstructure and shear property of novel epoxy composite SAC305 solder joints. Polymers, 15.","DOI":"10.3390\/polym15204168"},{"key":"ref_28","unstructured":"(2003). Test Methods for Lead-Free Solders\u2014Part 7: Methods for Shear Strength of Solder Joints on Chip Components (Standard No. JIS Z3198-7)."},{"key":"ref_29","doi-asserted-by":"crossref","unstructured":"Ohno, Y., and Yu, Q. (2019, January 4\u20136). Evaluation of fatigue life considering fillet shape and microstructure nonuniformity of solder joint in chip resistor. Proceedings of the 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), Singapore.","DOI":"10.1109\/EPTC47984.2019.9026660"},{"key":"ref_30","doi-asserted-by":"crossref","unstructured":"Zheng, G., and Wang, C. (2009, January 10\u201313). Shape and fatigue life prediction of chip resistor solder joints. Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, China.","DOI":"10.1109\/ICEPT.2009.5270612"},{"key":"ref_31","doi-asserted-by":"crossref","first-page":"542","DOI":"10.1016\/j.jallcom.2007.04.047","article-title":"The growth and roughness evolution of intermetallic compounds of Sn\u2013Ag\u2013Cu\/Cu interface during soldering reaction","volume":"458","author":"Yu","year":"2008","journal-title":"J. Alloys Compd."},{"key":"ref_32","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1016\/j.mser.2005.03.001","article-title":"Interfacial reactions between lead-free solders and common base materials","volume":"49","author":"Laurila","year":"2005","journal-title":"Mater. Sci. Eng. R"},{"key":"ref_33","doi-asserted-by":"crossref","first-page":"317","DOI":"10.1016\/S1359-6462(00)00590-X","article-title":"Growth kinetics of intermetallic compounds in chip scale package solder joint","volume":"44","author":"Tu","year":"2001","journal-title":"Scr. Mater."},{"key":"ref_34","doi-asserted-by":"crossref","first-page":"111271","DOI":"10.1016\/j.matchar.2021.111271","article-title":"Growth behavior and formation mechanism of porous Cu3Sn in Cu\/Sn solder system","volume":"178","author":"Lin","year":"2021","journal-title":"Mater. Charact."},{"key":"ref_35","doi-asserted-by":"crossref","first-page":"9757","DOI":"10.1007\/s10854-018-9014-3","article-title":"Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)\/Cu solder joints","volume":"29","author":"Sun","year":"2018","journal-title":"J. Mater. Sci. Mater. Electron."},{"key":"ref_36","doi-asserted-by":"crossref","first-page":"1195","DOI":"10.1007\/s11664-002-0010-1","article-title":"Nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate","volume":"31","author":"Gagliano","year":"2002","journal-title":"J. Electron. Mater."},{"key":"ref_37","doi-asserted-by":"crossref","first-page":"291","DOI":"10.1557\/JMR.2002.0042","article-title":"Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn\u20133.5 Ag, Sn\u20133.8 Ag\u20130.7 Cu and Sn\u20130.7 Cu) on Cu","volume":"17","author":"Lee","year":"2002","journal-title":"J. Mater. Res."},{"key":"ref_38","doi-asserted-by":"crossref","first-page":"72","DOI":"10.1016\/j.intermet.2012.06.002","article-title":"Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn\u2013Ag\u2013Cu solder joints during thermal cycling","volume":"31","author":"Han","year":"2012","journal-title":"Intermetallics"},{"key":"ref_39","doi-asserted-by":"crossref","first-page":"107356","DOI":"10.1016\/j.ijfatigue.2022.107356","article-title":"Research on thermal fatigue failure mechanism of BGA solder joints based on microstructure evolution","volume":"167","author":"Li","year":"2023","journal-title":"Int. J. Fatigue"},{"key":"ref_40","first-page":"1","article-title":"Solder joint failures under thermo-mechanical loading conditions\u2013A review","volume":"7","author":"Depiver","year":"2021","journal-title":"Adv. Mater. Process. Technol."},{"key":"ref_41","doi-asserted-by":"crossref","first-page":"90","DOI":"10.1016\/j.microrel.2011.07.093","article-title":"A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products","volume":"52","author":"Shnawah","year":"2012","journal-title":"Microelectron. Reliab."},{"key":"ref_42","doi-asserted-by":"crossref","first-page":"880","DOI":"10.1007\/s11664-008-0400-0","article-title":"Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability","volume":"37","author":"Xu","year":"2008","journal-title":"J. Electron. Mater."},{"key":"ref_43","doi-asserted-by":"crossref","unstructured":"Liu, J., Ye, Y., Xie, X., and Zhou, X. (2022). Effect of MWNT functionalization with tunable-length block copolymers on dispersity of MWNTs and mechanical properties of epoxy\/MWNT composites. Polymers, 14.","DOI":"10.3390\/polym14153137"},{"key":"ref_44","doi-asserted-by":"crossref","first-page":"110226","DOI":"10.1016\/j.tws.2022.110226","article-title":"On improvement of the interlaminar shear strength of carbon fiber\/epoxy laminates with magnetically guided steel particles","volume":"182","author":"Zhang","year":"2023","journal-title":"Thin-Walled Struct."},{"key":"ref_45","doi-asserted-by":"crossref","first-page":"799","DOI":"10.1016\/j.jallcom.2016.12.037","article-title":"Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles","volume":"696","author":"Wen","year":"2017","journal-title":"J. Alloys Compd."},{"key":"ref_46","doi-asserted-by":"crossref","first-page":"586","DOI":"10.1016\/j.scriptamat.2012.01.009","article-title":"On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints","volume":"66","author":"Yazzie","year":"2012","journal-title":"Scr. Mater."}],"container-title":["Polymers"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/2073-4360\/16\/18\/2597\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,10]],"date-time":"2025-10-10T15:56:11Z","timestamp":1760111771000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/2073-4360\/16\/18\/2597"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,9,14]]},"references-count":46,"journal-issue":{"issue":"18","published-online":{"date-parts":[[2024,9]]}},"alternative-id":["polym16182597"],"URL":"https:\/\/doi.org\/10.3390\/polym16182597","relation":{},"ISSN":["2073-4360"],"issn-type":[{"value":"2073-4360","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,9,14]]}}}