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The 3,6-bis(thiophen-2-yl)diketopyrrolopyrroles (TDPP) derivative is recognized for its high molar extinction coefficient. In this research, we have synthesized a diamine monomer named 3,6-bis[5-(4-amino-3-fluorophenyl)thiophen-2-yl]-2,5-bis(2-ethylhexyl)pyrrolo[4,3-c]pyrrole-1,4-dione (DPPTENFPDA), featuring a TDPP unit attached by fluorinated benzene rings. The subsequent reaction of DPPTENFPDA with pyromellitic dianhydride (PMDA) yielded an inherent BPI (DPPTENFPPI). By introducing chromophores derived from TDPP, the light absorption spectrum of DPPTENFPPI was broadened and red-shifted, thereby achieving full absorption within the visible spectrum and producing a highly black color that has a cut-off wavelength (\u03bbcut) of 717 nm and a CIE-Lab coordinate L* of 0.86. Additionally, DPPTENFPPI exhibited a low coefficient of thermal expansion (CTE) and remarkable thermal and electrical performance. Density functional theory calculations were conducted to explore the electronic nature of DPPTENFPPI. The outcomes revealed that the excellent light absorption of DPPTENFPPI predominantly originates from the transition from HOMO to LUMO + 1 within the chromophore moiety. The FCCL made from DPPTENFPPI films has high solder heat resistance and peel strength. This research contributes valuable insights into the structure and design of high-performance intrinsically black PIs for microelectronics applications.<\/jats:p>","DOI":"10.3390\/polym16233365","type":"journal-article","created":{"date-parts":[[2024,12,2]],"date-time":"2024-12-02T03:50:57Z","timestamp":1733111457000},"page":"3365","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":3,"title":["Synthesis and Characterization of Polyimide with High Blackness and Low Thermal Expansion by Introducing 3,6-bis(thiophen-2-yl)diketopyrrolopyrrole-Based Chromophores"],"prefix":"10.3390","volume":"16","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-7860-8532","authenticated-orcid":false,"given":"Yiwu","family":"Liu","sequence":"first","affiliation":[{"name":"National and Local Joint Engineering Research Center for Advanced Packaging Materials and Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xueyuan","family":"Liu","sequence":"additional","affiliation":[{"name":"National and Local Joint Engineering Research Center for Advanced Packaging Materials and Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1642-5006","authenticated-orcid":false,"given":"Jinghua","family":"Tan","sequence":"additional","affiliation":[{"name":"National and Local Joint Engineering Research Center for Advanced Packaging Materials and Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jie","family":"Huang","sequence":"additional","affiliation":[{"name":"National and Local Joint Engineering Research Center for Advanced Packaging Materials and Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jiazhen","family":"Yuan","sequence":"additional","affiliation":[{"name":"National and Local Joint Engineering Research Center for Advanced Packaging Materials and Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Huipeng","family":"Li","sequence":"additional","affiliation":[{"name":"National and Local Joint Engineering Research Center for Advanced Packaging Materials and Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jieping","family":"Guo","sequence":"additional","affiliation":[{"name":"National and Local Joint Engineering Research Center for Advanced Packaging Materials and Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Penghao","family":"Yu","sequence":"additional","affiliation":[{"name":"National and Local Joint Engineering Research Center for Advanced Packaging Materials and Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yue","family":"Chen","sequence":"additional","affiliation":[{"name":"National and Local Joint Engineering Research Center for Advanced Packaging Materials and Technology, Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"1968","published-online":{"date-parts":[[2024,11,29]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"110508","DOI":"10.1016\/j.compscitech.2024.110508","article-title":"Hydrophobic PI\/SiO2 composites with excellent dielectric property and thermal stability via simple modification","volume":"249","author":"Mei","year":"2024","journal-title":"Compos. 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