{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,23]],"date-time":"2026-08-23T16:30:13Z","timestamp":1787502613985,"version":"build-2736575974"},"reference-count":48,"publisher":"MDPI AG","issue":"8","license":[{"start":{"date-parts":[[2026,4,8]],"date-time":"2026-04-08T00:00:00Z","timestamp":1775606400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"National Science and Technology Council","award":["NSTC 115-2222-E-214-001"],"award-info":[{"award-number":["NSTC 115-2222-E-214-001"]}]},{"award":["NSTC 115-2222-E-214-001"],"award-info":[{"award-number":["NSTC 115-2222-E-214-001"]}],"id":[{"id":"https:\/\/ror.org\/00wnb9798","id-type":"ROR","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Polymers"],"abstract":"<jats:p>This study systematically investigates the formulation\u2013property relationships of epoxy-based silver conductive adhesives by varying silver filler architecture, total filler loading, and organic carrier design. Rotational viscometry, four-point probe measurements, thermal conductivity analysis, and scanning electron microscopy (SEM) were employed to elucidate the correlations among rheological behavior, conductive network formation, and electrical\u2013thermal transport properties. All formulations incorporate dicyandiamide (DICY) as a latent curing agent, in combination with a thermally activated accelerator and silane coupling agents, to stabilize filler\u2013matrix interfaces and suppress moisture-assisted side reactions. This latent curing chemistry enables effective low temperature curing at approximately 155 \u00b0C, providing compatibility with temperature-sensitive flexible polymer substrates. After sealed storage at 25 \u00b0C and 60% relative humidity for two weeks, all formulations exhibited viscosity variations within \u226416%, demonstrating extended pot life and good storage stability under ambient conditions. Meanwhile, the normalized volume resistivity and thermal conductivity remained close to their initial values, with maximum relative deviations of approximately 12% and 7%, respectively, from the initial (Day 0) values across all formulations, indicating stable electrical and thermal transport properties during storage. Differences in conductive network formation and filler packing characteristics were reflected in the observed electrical and thermal transport behaviors. Balanced electrical\u2013thermal performance was achieved without the need for high-temperature sintering or post-annealing, underscoring the effectiveness of the low temperature curing strategy. Overall, this work defines a practical formulation design window that simultaneously achieves low temperature curability, long pot life, stable rheology, and robust electrical\u2013thermal performance. The results provide useful material-level guidelines for the development of epoxy-based silver conductive adhesives intended for conductive interconnects on flexible polymer substrates and related flexible electronic applications.<\/jats:p>","DOI":"10.3390\/polym18080899","type":"journal-article","created":{"date-parts":[[2026,4,8]],"date-time":"2026-04-08T09:49:44Z","timestamp":1775641784000},"page":"899","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Silver Conductive Adhesives with Long Pot Life and Stable Electrical\u2013Thermal Performance"],"prefix":"10.3390","volume":"18","author":[{"ORCID":"https:\/\/orcid.org\/0009-0004-6066-0366","authenticated-orcid":false,"given":"Wilson Hou-Sheng","family":"Huang","sequence":"first","affiliation":[{"name":"Center for Continuing Education, National Tsing Hua University, Hsinchu 30013, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jyh-Ferng","family":"Yang","sequence":"additional","affiliation":[{"name":"Department of Chemical Engineering, I-Shou University, Kaohsiung 84001, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8716-0135","authenticated-orcid":false,"given":"Yi-Cang","family":"Lai","sequence":"additional","affiliation":[{"name":"Department of Chemical Engineering, I-Shou University, Kaohsiung 84001, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3670-6710","authenticated-orcid":false,"given":"Jem-Kun","family":"Chen","sequence":"additional","affiliation":[{"name":"Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 106335, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2026,4,8]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","unstructured":"Song, G.S., Lee, D.S., and Kang, I. (2016). The effects of in situ-formed silver nanoparticles on the electrical properties of epoxy resin filled with silver nanowires. Polymers, 8.","DOI":"10.3390\/polym8040157"},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"1890","DOI":"10.1021\/acsaelm.9b00401","article-title":"Molecular approach to enhance thermal conductivity in electrically conductive adhesives","volume":"1","author":"Tseng","year":"2019","journal-title":"ACS Appl. Electron. Mater."},{"key":"ref_3","doi-asserted-by":"crossref","unstructured":"Jin, I.S., Lee, H.D., Hong, S.I., Lee, W., and Jung, J.W. (2021). Facile post treatment of Ag nanowire\/polymer composites for flexible transparent electrodes and thin film heaters. Polymers, 13.","DOI":"10.3390\/polym13040586"},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"100561","DOI":"10.1016\/j.mtcomm.2019.100561","article-title":"Study on epoxy resin-based thermal adhesive composite incorporated with expanded graphite\/silver flake hybrids","volume":"20","author":"Kumar","year":"2019","journal-title":"Mater. Today Commun."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"220","DOI":"10.1016\/j.ijadhadh.2013.03.004","article-title":"High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic package","volume":"44","author":"Cui","year":"2013","journal-title":"Int. J. Adhes. Adhes."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"110074","DOI":"10.1016\/j.compscitech.2023.110074","article-title":"Enhancement of the electrical and thermal conductivity of epoxy-based composite films through the construction of the multi-scale conductive bridge structure","volume":"239","author":"Zhang","year":"2023","journal-title":"Compos. Sci. Technol."},{"key":"ref_7","doi-asserted-by":"crossref","unstructured":"Wang, Z., Wang, D., Zhang, C., Chen, W., Meng, Q., Yuan, H., and Yang, S. (2023). A fluorinated polyimide-based nano silver paste with high thermal resistance and outstanding thixotropic performance. Polymers, 15.","DOI":"10.3390\/polym15051150"},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"603","DOI":"10.5370\/JEET.2013.8.3.603","article-title":"Characterization of inkjet-printed silver patterns for application to printed circuit board (PCB)","volume":"8","author":"Shin","year":"2013","journal-title":"J. Electr. Eng. Technol."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"790","DOI":"10.1016\/j.mssp.2014.08.023","article-title":"Influence of silver paste rheology and screen parameters on the front side metallization of silicon solar cell","volume":"27","author":"Thibert","year":"2014","journal-title":"Mater. Sci. Semicond. Process."},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"1123","DOI":"10.1007\/s13233-024-00296-0","article-title":"Screen printing and electrical properties of silver paste using a robust biopolymer binder for fine line electrode in energy devices","volume":"32","author":"Lee","year":"2024","journal-title":"Macromol. Res."},{"key":"ref_11","doi-asserted-by":"crossref","unstructured":"Nam, H.J., Shin, M., Koo, H.Y., Park, S.-H., Nam, H.M., and Nam, S.-Y. (2024). Physical properties of paste synthesized from wet- and dry-processed silver powders. Materials, 17.","DOI":"10.3390\/ma17061273"},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"27026","DOI":"10.1039\/D5RA03728J","article-title":"Preparation and printing optimization of an organic carrier for silver paste on the front side of solar cells","volume":"15","author":"Hu","year":"2025","journal-title":"RSC Adv."},{"key":"ref_13","doi-asserted-by":"crossref","unstructured":"Bari, G.A.K.M.R., Jeong, J.-H., and Barai, H.R. (2024). Conductive gels for energy storage, conversion, and generation: Materials design strategies, properties, and applications. Materials, 17.","DOI":"10.3390\/ma17102268"},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"788","DOI":"10.1016\/j.matchemphys.2011.12.013","article-title":"Development of high concentrated aqueous silver nanofluid and inkjet printing on ceramic substrates","volume":"132","author":"Kosmala","year":"2012","journal-title":"Mater. Chem. Phys."},{"key":"ref_15","doi-asserted-by":"crossref","first-page":"137977","DOI":"10.1016\/j.colsurfa.2025.137977","article-title":"Tailored silver precursor ink via amine ligand engineering for high-performance flexible wireless devices","volume":"726","author":"Yang","year":"2025","journal-title":"Colloids Surf. A"},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1021\/acsaelm.3c00910","article-title":"Advanced applications of metal\u2013organic decomposition inks in printed electronics","volume":"6","author":"Kell","year":"2024","journal-title":"ACS Appl. Electron. Mater."},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"102596","DOI":"10.1016\/j.ijadhadh.2020.102596","article-title":"A review on epoxy-based electrically conductive adhesives","volume":"99","author":"Aradhana","year":"2020","journal-title":"Int. J. Adhes. Adhes."},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"126959","DOI":"10.1016\/j.polymer.2024.126959","article-title":"Construction of silver\u2013epoxy adhesive with suppressed silver migration rate based on thiol\u2013silver interaction","volume":"300","author":"Guo","year":"2024","journal-title":"Polymer"},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"654","DOI":"10.1016\/j.jtice.2013.01.001","article-title":"Enhanced thermal and mechanical properties of epoxy composites filled with silver nanowires and nanoparticles","volume":"44","author":"Yu","year":"2013","journal-title":"J. Taiwan Inst. Chem. Eng."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"20663","DOI":"10.1039\/C9RA03090E","article-title":"Ag-NPs\/MWCNT composite-modified silver-epoxy paste with improved thermal conductivity","volume":"9","author":"Li","year":"2019","journal-title":"RSC Adv."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"24","DOI":"10.1016\/S1875-5372(12)60024-1","article-title":"Study on properties of conductive adhesive prepared with silver nanoparticles modified by silane coupling agent","volume":"41","author":"Li","year":"2012","journal-title":"Rare Met. Mater. Eng."},{"key":"ref_22","doi-asserted-by":"crossref","first-page":"2459","DOI":"10.1007\/s11664-014-3202-6","article-title":"Review on joint shear strength of nano-silver paste and its long-term high temperature reliability","volume":"43","author":"Khazaka","year":"2014","journal-title":"J. Electron. Mater."},{"key":"ref_23","doi-asserted-by":"crossref","first-page":"232","DOI":"10.1007\/s11664-010-1421-z","article-title":"Electrical resistance and microstructural changes of silver\u2013epoxy isotropic conductive adhesive joints under high humidity and heat","volume":"40","author":"Kim","year":"2011","journal-title":"J. Electron. Mater."},{"key":"ref_24","doi-asserted-by":"crossref","first-page":"9","DOI":"10.1016\/j.reactfunctpolym.2018.09.017","article-title":"Examining the effects of storage on the initiation behaviour of ionic liquids towards the cure of epoxy resins","volume":"133","author":"Binks","year":"2018","journal-title":"React. Funct. Polym."},{"key":"ref_25","doi-asserted-by":"crossref","first-page":"30","DOI":"10.1016\/j.cej.2017.12.086","article-title":"A novel and feasible approach for one-pack flame-retardant epoxy resin with long pot life and fast curing","volume":"337","author":"Xu","year":"2018","journal-title":"Chem. Eng. J."},{"key":"ref_26","doi-asserted-by":"crossref","unstructured":"Wang, Y., Liu, W., Qiu, Y., and Wei, Y. (2018). A One-Component, Fast-Cure, and Economical Epoxy Resin System Suitable for Liquid Molding of Automotive Composite Parts. Materials, 11.","DOI":"10.3390\/ma11050685"},{"key":"ref_27","doi-asserted-by":"crossref","first-page":"109104","DOI":"10.1016\/j.porgcoat.2025.109104","article-title":"Metal laminates based on waterborne epoxy varnishes\u2014Chemical interactions and effect on fatigue crack growth kinetics","volume":"200","author":"Riedl","year":"2025","journal-title":"Prog. Org. Coat."},{"key":"ref_28","doi-asserted-by":"crossref","first-page":"305","DOI":"10.1016\/0040-6031(94)80188-6","article-title":"The effect of copper oxides on the curing of brominated epoxy resins","volume":"237","author":"Hong","year":"1994","journal-title":"Thermochim. Acta"},{"key":"ref_29","doi-asserted-by":"crossref","first-page":"782","DOI":"10.1002\/app.34008","article-title":"Microencapsulation of imidazole curing agents by spray-drying method","volume":"122","author":"Lee","year":"2011","journal-title":"J. Appl. Polym. Sci."},{"key":"ref_30","doi-asserted-by":"crossref","unstructured":"Nam, H.J., Hwangbo, Y.H., Nam, S.Y., and Nam, H.M. (2023). Development and performance evaluation of stretchable silver pastes for screen printing on thermoplastic polyurethane films. Coatings, 13.","DOI":"10.3390\/coatings13091499"},{"key":"ref_31","doi-asserted-by":"crossref","first-page":"41183","DOI":"10.1002\/app.41183","article-title":"The influence of dispersants that contain polyethylene oxide groups on the electrical resistivity of silver paste","volume":"131","author":"Chiang","year":"2014","journal-title":"J. Appl. Polym. Sci."},{"key":"ref_32","doi-asserted-by":"crossref","first-page":"35167","DOI":"10.1021\/acsami.2c05191","article-title":"Self-assembled 4-aminopyridine monolayer as a nucleation-inducing layer for transparent silver electrodes","volume":"14","author":"Jeon","year":"2022","journal-title":"ACS Appl. Mater. Interfaces"},{"key":"ref_33","doi-asserted-by":"crossref","first-page":"4177","DOI":"10.1109\/TED.2025.3579453","article-title":"Narrow spectrum resonator quantum dots mini-LED based on flip structure for photodynamic therapy","volume":"72","author":"Lin","year":"2025","journal-title":"IEEE Trans. Electron Devices"},{"key":"ref_34","doi-asserted-by":"crossref","first-page":"113667","DOI":"10.1016\/j.solmat.2025.113667","article-title":"Research of screen printing low-temperature silver paste for III\u2013V solar cell","volume":"289","author":"Dai","year":"2025","journal-title":"Sol. Energy Mater. Sol. Cells"},{"key":"ref_35","unstructured":"Petrie, E.M. (2006). Epoxy Adhesive Formulations, McGraw-Hill."},{"key":"ref_36","doi-asserted-by":"crossref","unstructured":"Yi, Y., Tian, Z., Chi, K., Jiang, R., Lv, Y., Sun, Q., and Zhu, Y. (2023). Improvement in the thermal conductivity of silver epoxy adhesive by treating with water vapor. Polymers, 15.","DOI":"10.3390\/polym15102338"},{"key":"ref_37","doi-asserted-by":"crossref","first-page":"427","DOI":"10.3390\/polym3010427","article-title":"Electrically conductive epoxy adhesives","volume":"3","author":"Sancaktar","year":"2011","journal-title":"Polymers"},{"key":"ref_38","unstructured":"(2019). Test Method Standard Microcircuits, Method 2019 (Standard No. MIL-STD-883)."},{"key":"ref_39","unstructured":"Epoxy Technology Inc. (2026). EPO-TEK\u00ae H20E Technical Data Sheet, Epoxy Technology Inc."},{"key":"ref_40","unstructured":"Henkel AG & Co. KGaA (2016). LOCTITE ABLESTIK C 805-1 Technical Data Sheet, Henkel AG & Co. KGaA."},{"key":"ref_41","unstructured":"Henkel AG & Co. KGaA (2016). LOCTITE ABLESTIK 3888 Technical Data Sheet, Henkel AG & Co. KGaA."},{"key":"ref_42","unstructured":"MG Chemicals (2022). 8331 Conductive Epoxy Adhesive Technical Data Sheet, MG Chemicals."},{"key":"ref_43","doi-asserted-by":"crossref","first-page":"105","DOI":"10.1016\/j.ijadhadh.2009.09.004","article-title":"Shelf stability of reactive adhesive formulations: A case study for dicyandiamide-cured epoxy systems","volume":"30","author":"Raetzke","year":"2010","journal-title":"Int. J. Adhes. Adhes."},{"key":"ref_44","doi-asserted-by":"crossref","first-page":"2870","DOI":"10.1021\/acs.macromol.4c02707","article-title":"Novel Thermal Latent Curing Agents for Epoxy Resins Based on Dual-Locked Aminopyridines by Amidation and N-Oxidation","volume":"58","author":"Ito","year":"2025","journal-title":"Macromolecules"},{"key":"ref_45","doi-asserted-by":"crossref","first-page":"591","DOI":"10.1007\/s13726-013-0158-y","article-title":"Curing Behavior of Dicyandiamide\/Epoxy Resin System Using Different Accelerators","volume":"22","author":"Hayaty","year":"2013","journal-title":"Iran. Polym. J."},{"key":"ref_46","first-page":"409","article-title":"Thermally-Latent Curing Agents for Epoxy Resins: A Review","volume":"31","author":"Mozaffari","year":"2019","journal-title":"Iran. J. Polym. Sci. Technol."},{"key":"ref_47","doi-asserted-by":"crossref","first-page":"109629","DOI":"10.1016\/j.polymdegradstab.2021.109629","article-title":"A Bi-DOPO Type of Flame Retardancy Epoxy Prepolymer: Synthesis, Properties and Flame-Retardant Mechanism","volume":"190","author":"Liu","year":"2021","journal-title":"Polym. Degrad. Stab."},{"key":"ref_48","doi-asserted-by":"crossref","unstructured":"Pham, H.Q., and Marks, M.J. (2005). Epoxy Resins. Ullmann\u2019s Encyclopedia of Industrial Chemistry, Wiley-VCH.","DOI":"10.1002\/14356007.a09_547.pub2"}],"container-title":["Polymers"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/2073-4360\/18\/8\/899\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,4,10]],"date-time":"2026-04-10T04:22:35Z","timestamp":1775794955000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/2073-4360\/18\/8\/899"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4,8]]},"references-count":48,"journal-issue":{"issue":"8","published-online":{"date-parts":[[2026,4]]}},"alternative-id":["polym18080899"],"URL":"https:\/\/doi.org\/10.3390\/polym18080899","relation":{},"ISSN":["2073-4360"],"issn-type":[{"value":"2073-4360","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,4,8]]}}}