{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,2]],"date-time":"2026-06-02T09:24:53Z","timestamp":1780392293645,"version":"3.54.1"},"reference-count":25,"publisher":"MDPI AG","issue":"15","license":[{"start":{"date-parts":[[2024,7,24]],"date-time":"2024-07-24T00:00:00Z","timestamp":1721779200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52227806"],"award-info":[{"award-number":["52227806"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["ZZYJKT2023-07"],"award-info":[{"award-number":["ZZYJKT2023-07"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["CJGJZD20220517141804010"],"award-info":[{"award-number":["CJGJZD20220517141804010"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["1053320221934"],"award-info":[{"award-number":["1053320221934"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"State Key Laboratory of Precision Manufacturing for Extreme Service Performance","award":["52227806"],"award-info":[{"award-number":["52227806"]}]},{"name":"State Key Laboratory of Precision Manufacturing for Extreme Service Performance","award":["ZZYJKT2023-07"],"award-info":[{"award-number":["ZZYJKT2023-07"]}]},{"name":"State Key Laboratory of Precision Manufacturing for Extreme Service Performance","award":["CJGJZD20220517141804010"],"award-info":[{"award-number":["CJGJZD20220517141804010"]}]},{"name":"State Key Laboratory of Precision Manufacturing for Extreme Service Performance","award":["1053320221934"],"award-info":[{"award-number":["1053320221934"]}]},{"name":"Shenzhen Science and Technology Plan Project","award":["52227806"],"award-info":[{"award-number":["52227806"]}]},{"name":"Shenzhen Science and Technology Plan Project","award":["ZZYJKT2023-07"],"award-info":[{"award-number":["ZZYJKT2023-07"]}]},{"name":"Shenzhen Science and Technology Plan Project","award":["CJGJZD20220517141804010"],"award-info":[{"award-number":["CJGJZD20220517141804010"]}]},{"name":"Shenzhen Science and Technology Plan Project","award":["1053320221934"],"award-info":[{"award-number":["1053320221934"]}]},{"name":"Postgraduate Research Innovation of Central South University","award":["52227806"],"award-info":[{"award-number":["52227806"]}]},{"name":"Postgraduate Research Innovation of Central South University","award":["ZZYJKT2023-07"],"award-info":[{"award-number":["ZZYJKT2023-07"]}]},{"name":"Postgraduate Research Innovation of Central South University","award":["CJGJZD20220517141804010"],"award-info":[{"award-number":["CJGJZD20220517141804010"]}]},{"name":"Postgraduate Research Innovation of Central South University","award":["1053320221934"],"award-info":[{"award-number":["1053320221934"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Flexible electronics have revolutionized the field by overcoming the rigid limitations of traditional devices, offering superior flexibility and adaptability. Conductive ink performance is crucial, directly impacting the stability of flexible electronics. While metal filler-based inks exhibit excellent conductivity, they often lack mechanical stability. To address this challenge, we present a novel conductive ink utilizing a ternary composite filler system: liquid metal and two micron-sized silver morphologies (particles and flakes). We systematically investigated the influence of filler type, mass ratio, and sintering process parameters on the composite ink\u2019s conductivity and mechanical stability. Our results demonstrate that flexible wires fabricated with the liquid metal\/micron silver particle\/micron silver flake composite filler exhibit remarkable conductivity and exceptional bending stability. Interestingly, increasing the liquid metal content results in a trade-off, compromising conductivity while enhancing mechanical performance. After enduring 5000 bending cycles, the resistance change in wires formulated with a 4:1 mass ratio of micron silver particles to flakes is only half that of wires with a 1:1 ratio. This study further investigates the mechanism governing resistance variations during flexible wire bending. Additionally, we observed a positive correlation between sintering temperature and pressure with the conductivity of flexible wires. The significance of the sintering parameters on conductivity follows a descending order: sintering temperature, sintering pressure, and sintering time. Finally, we demonstrate the practical application of this technology by integrating the composite ink-based flexible wires with conductive polymer-based strain sensors. This combination successfully achieved the detection of human movements, including finger and wrist bending.<\/jats:p>","DOI":"10.3390\/s24154795","type":"journal-article","created":{"date-parts":[[2024,7,24]],"date-time":"2024-07-24T10:46:20Z","timestamp":1721817980000},"page":"4795","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":6,"title":["Integrating High-Performance Flexible Wires with Strain Sensors for Wearable Human Motion Detection"],"prefix":"10.3390","volume":"24","author":[{"given":"Pucheng","family":"Wu","sequence":"first","affiliation":[{"name":"State Key Laboratory of Precision Manufacturing for Extreme Service Performance, College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4199-027X","authenticated-orcid":false,"given":"Hu","family":"He","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Precision Manufacturing for Extreme Service Performance, College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"1968","published-online":{"date-parts":[[2024,7,24]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"405","DOI":"10.1039\/D2NR04551F","article-title":"Intelligent wearable devices based on nanomaterials and nanostructures for healthcare","volume":"15","author":"Xie","year":"2023","journal-title":"Nanoscale"},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"103689","DOI":"10.1016\/j.mechrescom.2021.103689","article-title":"Mechanical analysis of adhesive interface between wearable electronics and skin","volume":"113","author":"Fu","year":"2021","journal-title":"Mech. Res. Commun."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"150501","DOI":"10.1063\/5.0057020","article-title":"A perspective on flexible sensors in developing diagnostic devices","volume":"119","author":"Wang","year":"2021","journal-title":"Appl. Phys. Lett."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"1902062","DOI":"10.1002\/adma.201902062","article-title":"Flexible hybrid electronics for digital healthcare","volume":"32","author":"Ma","year":"2020","journal-title":"Adv. Mater."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"1902051","DOI":"10.1002\/adma.201902051","article-title":"Printing flexible and hybrid electronics for human skin and eye-interfaced health monitoring systems","volume":"32","author":"Kim","year":"2020","journal-title":"Adv. Mater."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"1902133","DOI":"10.1002\/adma.201902133","article-title":"Flexible hybrid sensors for health monitoring: Materials and mechanisms to render wearability","volume":"32","author":"Gao","year":"2020","journal-title":"Adv. Mater."},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"1800628","DOI":"10.1002\/admt.201800628","article-title":"Multifunctional skin-inspired flexible sensor systems for wearable electronics","volume":"4","author":"Xu","year":"2019","journal-title":"Adv. Mater. Technol."},{"key":"ref_8","doi-asserted-by":"crossref","first-page":"2001187","DOI":"10.1002\/adem.202001187","article-title":"Recent progress in flexible pressure sensors based electronic skin","volume":"23","author":"Zhao","year":"2021","journal-title":"Adv. Eng. Mater."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"502009","DOI":"10.1088\/1361-6528\/abefff","article-title":"Printable conductive inks used for the fabrication of electronics: An overview","volume":"32","author":"Dimitriou","year":"2021","journal-title":"Nanotechnology"},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"32225","DOI":"10.1021\/acsami.9b04589","article-title":"Screen-Printing of a Highly Conductive Graphene Ink for Flexible Printed Electronics","volume":"11","author":"He","year":"2019","journal-title":"ACS Appl. Mater. Interfaces"},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"1907284","DOI":"10.1002\/adfm.201907284","article-title":"Direct Graphene-Carbon Nanotube Composite Ink Writing All-Solid-State Flexible Microsupercapacitors with High Areal Energy Density","volume":"30","author":"Wang","year":"2020","journal-title":"Adv. Funct. Mater."},{"key":"ref_12","first-page":"1509","article-title":"Preparation of metal nanoparticles-based conductive inks and their applications in printed electronics","volume":"27","author":"Cui","year":"2015","journal-title":"Prog. Chem."},{"key":"ref_13","doi-asserted-by":"crossref","unstructured":"Tomotoshi, D., and Kawasaki, H. (2020). Surface and interface designs in copper-based conductive inks for printed\/flexible electronics. Nanomaterials, 10.","DOI":"10.3390\/nano10091689"},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"50852","DOI":"10.1021\/acsami.0c15084","article-title":"Printable Liquid Metal Microparticle Ink for Ultrastretchable Electronics","volume":"12","author":"Li","year":"2020","journal-title":"ACS Appl. Mater. 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Reliab."},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"8636","DOI":"10.1039\/D2RA07889A","article-title":"Parametric study on conductive patterns by low-temperature sintering of micron silver ink","volume":"13","author":"Zhao","year":"2023","journal-title":"RSC Adv."},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"3070","DOI":"10.1039\/D0TC06044E","article-title":"Self-sintering liquid metal ink with LAPONITE\u00ae for flexible electronics","volume":"9","author":"Wu","year":"2021","journal-title":"J. Mater. Chem. C"},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"e2301292","DOI":"10.1002\/advs.202301292","article-title":"Ultrasonic-Enabled Nondestructive and Substrate-Independent Liquid Metal Ink Sintering","volume":"10","author":"Liu","year":"2023","journal-title":"Adv. Sci."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"085401","DOI":"10.1088\/1361-6463\/abc77b","article-title":"Novel conductive polymer composites based on CNTs\/CNFs bridged liquid metal","volume":"54","author":"Pan","year":"2020","journal-title":"J. Phys. D Appl. Phys."},{"key":"ref_22","doi-asserted-by":"crossref","first-page":"384003","DOI":"10.1088\/1361-6463\/ac7988","article-title":"Fabrication and integration of functional stretchable circuit based on liquid metal","volume":"55","author":"Pan","year":"2022","journal-title":"J. Phys. D Appl. Phys."},{"key":"ref_23","doi-asserted-by":"crossref","first-page":"2673","DOI":"10.1002\/adfm.200800306","article-title":"Theoretical and experimental studies of bending of inorganic electronic materials on plastic substrates","volume":"18","author":"Park","year":"2008","journal-title":"Adv. Funct. Mater."},{"key":"ref_24","doi-asserted-by":"crossref","first-page":"838","DOI":"10.1016\/j.microrel.2014.12.015","article-title":"Electromechanical properties of printed copper ink film using a white flash light annealing process for flexible electronics","volume":"55","author":"Eun","year":"2015","journal-title":"Microelectron. Reliab."},{"key":"ref_25","first-page":"516","article-title":"A two-step method to prepare silver nanoparticles ink for improving electrical and mechanical properties of printed silver wire","volume":"11","author":"Li","year":"2021","journal-title":"Mater. 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