{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,19]],"date-time":"2026-01-19T05:39:46Z","timestamp":1768801186350,"version":"3.49.0"},"reference-count":22,"publisher":"MDPI AG","issue":"19","license":[{"start":{"date-parts":[[2022,9,28]],"date-time":"2022-09-28T00:00:00Z","timestamp":1664323200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001871","name":"European Regional Development Fund","doi-asserted-by":"publisher","award":["PTDC\/CTM CTM\/31953\/2017"],"award-info":[{"award-number":["PTDC\/CTM CTM\/31953\/2017"]}],"id":[{"id":"10.13039\/501100001871","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001871","name":"European Regional Development Fund","doi-asserted-by":"publisher","award":["PD\/BD\/128419\/2017"],"award-info":[{"award-number":["PD\/BD\/128419\/2017"]}],"id":[{"id":"10.13039\/501100001871","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Funda\u00e7\u00e3o para a Ci\u00eancia e a Tecnologia (FCT) of Portugal","award":["PTDC\/CTM CTM\/31953\/2017"],"award-info":[{"award-number":["PTDC\/CTM CTM\/31953\/2017"]}]},{"name":"Funda\u00e7\u00e3o para a Ci\u00eancia e a Tecnologia (FCT) of Portugal","award":["PD\/BD\/128419\/2017"],"award-info":[{"award-number":["PD\/BD\/128419\/2017"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Applied Sciences"],"abstract":"<jats:p>The development of new materials for the electronics industry has been in focus in recent years, as circuit miniaturization poses challenges for conventional solutions. Dewetting of Cu films over diffusion-barrier layers has fostered an interest in developing new solutions with lower interfacial energies, to withstand processing and service life. Co-W is a candidate material for seedless Cu-interconnect deposition, but its behavior during annealing is still not properly addressed. This study used an in situ scanning-electron-microscopy (SEM) approach to assess how heating rates affect dewetting behavior, as well as to determine the limits of annealing of 40 nm-thick Cu films deposited over this substrate. The 10 \u00b0C\/min heating rate used showed copper dewetting starting at 450 \u00b0C, whereas the higher 30 \u00b0C\/min rate induced dewetting at 400 \u00b0C. The Cu film deposited over Ta exhibited slightly different dewetting, with its onset starting earlier, but developing a slower progression throughout the temperature range analyzed in the annealing treatments.<\/jats:p>","DOI":"10.3390\/app12199778","type":"journal-article","created":{"date-parts":[[2022,9,28]],"date-time":"2022-09-28T20:58:47Z","timestamp":1664398727000},"page":"9778","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["In Situ Annealing Behavior of Cu Thin Films Deposited over Co-W Diffusion Barrier Layers"],"prefix":"10.3390","volume":"12","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3920-6511","authenticated-orcid":false,"given":"Bruno M. C.","family":"Oliveira","sequence":"first","affiliation":[{"name":"Department of Metallurgical and Materials Engineering, University of Porto, 4200-465 Porto, Portugal"},{"name":"LAETA\/INEGI\u2014Institute of Science and Innovation in Mechanical and Industrial Engineering, 4200-465 Porto, Portugal"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5845-5698","authenticated-orcid":false,"given":"Ruben F.","family":"Santos","sequence":"additional","affiliation":[{"name":"Department of Metallurgical and Materials Engineering, University of Porto, 4200-465 Porto, Portugal"},{"name":"LAETA\/INEGI\u2014Institute of Science and Innovation in Mechanical and Industrial Engineering, 4200-465 Porto, Portugal"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3667-0562","authenticated-orcid":false,"given":"Manuel F.","family":"Vieira","sequence":"additional","affiliation":[{"name":"Department of Metallurgical and Materials Engineering, University of Porto, 4200-465 Porto, Portugal"},{"name":"LAETA\/INEGI\u2014Institute of Science and Innovation in Mechanical and Industrial Engineering, 4200-465 Porto, Portugal"}]}],"member":"1968","published-online":{"date-parts":[[2022,9,28]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"399","DOI":"10.1146\/annurev-matsci-070511-155048","article-title":"Solid-State Dewetting of Thin Films","volume":"42","author":"Thompson","year":"2012","journal-title":"Annu. 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