{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,12]],"date-time":"2026-03-12T09:42:45Z","timestamp":1773308565682,"version":"3.50.1"},"reference-count":21,"publisher":"MDPI AG","issue":"4","license":[{"start":{"date-parts":[[2024,2,7]],"date-time":"2024-02-07T00:00:00Z","timestamp":1707264000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100001871","name":"Funda\u00e7\u00e3o para a Ci\u00eancia e Tecnologia","doi-asserted-by":"publisher","award":["2020.04017.CEECIND"],"award-info":[{"award-number":["2020.04017.CEECIND"]}],"id":[{"id":"10.13039\/501100001871","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Polymers"],"abstract":"<jats:p>Semiconductor advancements demand greater integrated circuit density, structural miniaturization, and complex material combinations, resulting in stress concentrations from property mismatches. This study investigates the failure in two types of interfaces found in chip packages: silicon\u2013epoxy mold compound (EMC) and polyimide\u2013EMC. These interfaces were subjected to quasi-static and fatigue loading conditions. Employing a compliance-based beam method, the tests determined interfacial critical fracture energy values, (GIC), of 0.051 N\/mm and 0.037 N\/mm for the silicon\u2013EMC and polyimide\u2013EMC interfaces, respectively. Fatigue testing on the polyimide\u2013epoxy interface revealed a fatigue threshold strain energy, (Gth), of 0.042 N\/mm. We also observed diverse failure modes and discuss potential mechanical failures in multi-layer chip packages. The findings of this study can contribute to the prediction and mitigation of failure modes in the analyzed chip packaging. The obtained threshold energy and crack growth rate provide insights for designing safe lives for bi-material interfaces in chip packaging under cyclic loads. These insights can guide future research directions, emphasizing the improvement of material properties and exploration of the influence of manufacturing parameters on delamination in multilayer semiconductors.<\/jats:p>","DOI":"10.3390\/polym16040463","type":"journal-article","created":{"date-parts":[[2024,2,7]],"date-time":"2024-02-07T06:12:58Z","timestamp":1707286378000},"page":"463","update-policy":"https:\/\/doi.org\/10.3390\/mdpi_crossmark_policy","source":"Crossref","is-referenced-by-count":8,"title":["Mode I Fatigue and Fracture Assessment of Polyimide\u2013Epoxy and Silicon\u2013Epoxy Interfaces in Chip-Package Components"],"prefix":"10.3390","volume":"16","author":[{"given":"Pedro","family":"Morais","sequence":"first","affiliation":[{"name":"Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7168-7079","authenticated-orcid":false,"given":"Alireza","family":"Akhavan-Safar","sequence":"additional","affiliation":[{"name":"Institute of Science and Innovation in Mechanical and Industrial Engineering (INEGI), Rua Dr. Roberto Frias, 4200-465 Porto, Portugal"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1933-0865","authenticated-orcid":false,"given":"Ricardo J. C.","family":"Carbas","sequence":"additional","affiliation":[{"name":"Institute of Science and Innovation in Mechanical and Industrial Engineering (INEGI), Rua Dr. Roberto Frias, 4200-465 Porto, Portugal"}]},{"given":"Eduardo A. S.","family":"Marques","sequence":"additional","affiliation":[{"name":"Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal"}]},{"given":"Bala","family":"Karunamurthy","sequence":"additional","affiliation":[{"name":"Infineon Technologies Austria AG, Siemensstrasse 2, 9500 Villach, Austria"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3272-4591","authenticated-orcid":false,"given":"Lucas F. M.","family":"da Silva","sequence":"additional","affiliation":[{"name":"Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal"}]}],"member":"1968","published-online":{"date-parts":[[2024,2,7]]},"reference":[{"key":"ref_1","unstructured":"Samet, D.S. (2018). Development of a Fatigue-Compatible Cohesive Zone Method for A Copper-Epoxy Molding Compound Bimaterial Interface. [Ph.D. Thesis, Georgia Institute of Technology]."},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"60","DOI":"10.1016\/j.engfracmech.2017.05.008","article-title":"A fatigue crack propagation model with resistance curve effects for an epoxy\/copper interface","volume":"180","author":"Samet","year":"2017","journal-title":"Eng. Fract. Mech."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"109144","DOI":"10.1016\/j.engfracmech.2023.109144","article-title":"Crowbar Loading-A New Test Technique to Characterize Interfacial Delamination","volume":"282","author":"Rambhatla","year":"2023","journal-title":"Eng. Fract. Mech."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"108339","DOI":"10.1016\/j.engfracmech.2022.108339","article-title":"Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis","volume":"266","author":"Calabretta","year":"2022","journal-title":"Eng. Fract. Mech."},{"key":"ref_5","unstructured":"Thijsse, J., Van Driel, W., Van Gils, M., and Van Der Sluis, O. (2006, January 24\u201326). Interfacial adhesion method for semiconductor applications covering the full mode mixity. Proceedings of the EuroSime 2006\u20147th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, Como, Italy."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"137","DOI":"10.1016\/j.engfracmech.2018.02.014","article-title":"Fracture criterion of mixed-mode crack propagation along the interface in nanoscale components","volume":"193","author":"Yan","year":"2018","journal-title":"Eng. Fract. Mech."},{"key":"ref_7","doi-asserted-by":"crossref","unstructured":"Zhu, S.W., Shih, C.P., Chiu, T.C., and Shen, G. (2010, January 20\u201322). Delamination fracture characteristics for polyimide-related interfaces under fatigue loadings. Proceedings of the 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, Taipei, Taiwan.","DOI":"10.1109\/IMPACT.2010.5699574"},{"key":"ref_8","unstructured":"Schlottig, G. (2012). Reliability at the Chip Interfaces: Delaminating the Silicon Die From Molding Compound. [Ph.D. Thesis, Delft University of Technology]."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"781","DOI":"10.1016\/S0013-7944(99)00078-8","article-title":"Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method","volume":"64","author":"Wang","year":"1999","journal-title":"Eng. Fract. Mech."},{"key":"ref_10","unstructured":"Mavinkurve, A., Goumans, L., and Martens, J. (2013, January 9\u201312). Epoxy molding compounds for high temperature applications. Proceedings of the 2013 Eurpoean Microelectronics Packaging Conference (EMPC), Grenoble, France."},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"979","DOI":"10.1007\/s10853-012-6713-7","article-title":"Thermo-mechanical and fracture properties in single-crystal silicon","volume":"48","author":"Masolin","year":"2013","journal-title":"J. Mater. Sci."},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"1807738","DOI":"10.1002\/adma.201807738","article-title":"Advances in polyimide-based materials for space applications","volume":"31","author":"Gouzman","year":"2019","journal-title":"Adv. Mater."},{"key":"ref_13","doi-asserted-by":"crossref","unstructured":"Ehrhardt, J., Klimmer, A., Eisenmenger, J., M\u00fcller, T., Boyen, H.G., Ziemann, P., Biskupek, J., and Kaiser, U. (2006). Influence of ion induced amorphicity on the diffusion of gold into silicon. J. Appl. Phys., 100.","DOI":"10.1063\/1.2259815"},{"key":"ref_14","unstructured":"(2023, December 05). A Background to Silicon and Its Applications. Available online: https:\/\/www.azom.com\/properties.aspx?ArticleID=599."},{"key":"ref_15","unstructured":"(2023, December 05). Silica\u2014Silicon Dioxide (SiO2). Available online: https:\/\/www.azom.com\/article.aspx?ArticleID=1114."},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"1091","DOI":"10.1080\/00218460600948511","article-title":"Effect of adhesive type and thickness on the lap shear strength","volume":"82","author":"Rodrigues","year":"2006","journal-title":"J. Adhes."},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"96","DOI":"10.1016\/j.ijadhadh.2012.01.019","article-title":"Parametric study of adhesive joints with composites","volume":"37","author":"Neto","year":"2012","journal-title":"Int. J. Adhes. Adhes."},{"key":"ref_18","doi-asserted-by":"crossref","unstructured":"Perez, M., Akhavan-Safar, A., Carbas, R.J., Marques, E.A., Wenig, S., and da Silva, L.F. (2022). Loading rate and temperature interaction effects on the mode I fracture response of a ductile polyurethane adhesive used in the automotive industry. Materials, 15.","DOI":"10.3390\/ma15248948"},{"key":"ref_19","first-page":"291","article-title":"Paris law relations for an epoxy-based adhesive","volume":"234","author":"Rocha","year":"2020","journal-title":"Proc. Inst. Mech. Eng. Part J. Mater. Des. Appl."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"1175","DOI":"10.1016\/j.compositesa.2004.03.002","article-title":"Fatigue crack growth acceleration due to intermittent overstressing in adhesively bonded CFRP joints","volume":"35","author":"Erpolat","year":"2004","journal-title":"Compos. Part A Appl. Sci. Manuf."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"1389","DOI":"10.1109\/TCPMT.2016.2589223","article-title":"Experiments for obtaining cohesive-zone parameters for copper-mold compound interfacial delamination","volume":"6","author":"Krieger","year":"2016","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol."}],"container-title":["Polymers"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/2073-4360\/16\/4\/463\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,10]],"date-time":"2025-10-10T13:56:27Z","timestamp":1760104587000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/2073-4360\/16\/4\/463"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,2,7]]},"references-count":21,"journal-issue":{"issue":"4","published-online":{"date-parts":[[2024,2]]}},"alternative-id":["polym16040463"],"URL":"https:\/\/doi.org\/10.3390\/polym16040463","relation":{},"ISSN":["2073-4360"],"issn-type":[{"value":"2073-4360","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,2,7]]}}}