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However, its primary platforms face challenges such as low-quality content and underdeveloped virtual environments, leading to a subpar user experience. Artificial intelligence-generated content (AIGC) has emerged as a key driver in Metaverse development, enabling the efficient and cost-effective creation of digital content. AIGC also promotes personalized content, further enhancing the appeal of the Metaverse. Although AIGC holds great promise, comprehensive investigations into its underlying models and applications remain limited. This study begins with the core neural network architectures of generative AI and examines the relationship between the Metaverse and AIGC. It delves into the deep learning technologies that support AIGC, providing both qualitative and quantitative analyses of their advantages, limitations, and hardware constraints. We also review existing practical applications of the Metaverse, highlighting the challenges and future opportunities in key domains such as healthcare and education. The research concludes that while AIGC can markedly accelerate the development of the Metaverse, its technology must be more closely aligned with development needs to deliver a truly immersive experience. The integration of AIGC and the Metaverse represents the convergence of artificial intelligence, computer graphics, and human\u2013computer interaction. This interdisciplinary synergy has the potential to redefine the way we create, interact with, and experience digital environments, pushing the boundaries of creativity and immersion.<\/jats:p>","DOI":"10.34133\/research.0804","type":"journal-article","created":{"date-parts":[[2025,7,8]],"date-time":"2025-07-08T05:09:18Z","timestamp":1751951358000},"update-policy":"https:\/\/doi.org\/10.34133\/aaas_crossmark_01","source":"Crossref","is-referenced-by-count":12,"title":["Generative Artificial Intelligence in the Metaverse Era: A Review on Models and Applications"],"prefix":"10.34133","volume":"8","author":[{"given":"Han","family":"Zhou","sequence":"first","affiliation":[{"name":"School of Instrumentation and Optoelectronic Engineering, \rBeihang University, Beijing 100191, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xinyi","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Instrumentation and Optoelectronic Engineering, \rBeihang University, Beijing 100191, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9004-715X","authenticated-orcid":true,"given":"Jin","family":"Li","sequence":"additional","affiliation":[{"name":"School of Instrumentation and Optoelectronic Engineering, \rBeihang University, Beijing 100191, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zichen","family":"Zhang","sequence":"additional","affiliation":[{"name":"National Key Lab of Spintronics, School of Integrated Circuit Science and Engineering, \rBeihang University, Beijing 100191, China."},{"name":"Shanxi Key Laboratory of Advanced Semiconductor Optoelectronic Devices and Integrated Systems, Shanxi 048000, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yao","family":"Fu","sequence":"additional","affiliation":[{"name":"The Changchun Institute of Optics, Fine Mechanics and Physics, \rChinese Academy of Sciences, Changchun 130000, China."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mailyn P\u00e9rez","family":"Liva","sequence":"additional","affiliation":[{"name":"Department of Structure of Matter, Thermal Physics and Electronics, CEI Moncloa, \rUniversidad Complutense de Madrid, 28040 Madrid, Spain."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dov","family":"Greenbaum","sequence":"additional","affiliation":[{"name":"Department of Molecular Biophysics and Biochemistry, \rYale University, New Haven, CT 06520, USA."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Pan","family":"Hui","sequence":"additional","affiliation":[{"name":"The HKUST-DT System and Media Lab, \rHong Kong University of Science and Technology, Hong Kong 999077, China."}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"221","published-online":{"date-parts":[[2025,8,19]]},"reference":[{"key":"e_1_3_3_2_2","doi-asserted-by":"crossref","unstructured":"Duan H Li J Fan S Lin Z Wu X Cai W. 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