{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,6,2]],"date-time":"2022-06-02T04:11:34Z","timestamp":1654143094337},"reference-count":27,"publisher":"IGI Global","issue":"1","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,1,1]]},"abstract":"<p>With the improvements of electromechanical systems' automation and intelligence, contradiction between the high integration, high performance and miniaturization, low cost has become the principal reason restricting the development of electromechanical system. The emergence of molded interconnection device (MID) technology provides a new way to resolve this contradiction. Integration of the mechanical and electrical functions in electromechanical system onto the same polymer molded base structure, replacement of the tradition printed circuit board (PCB), design and processing of 3D circuit system on polymer molded base structure surface distinguishes MID technology from others. MID technology can not only save space occupied by the electromechanical system and improve the system integration, but also can simplify the assembly process and lower the cost. In this study, present research and future development of MID technology were introduced first. Then the main technical problems involved in MID processing including the design method of MID, materials technology, equipment technology, surface mounted devices (SMD) assembly technique, and so on were analyzed systematically. Finally, using the ultrasonic micro embossing technology, a manufacturing method of polymer circuit board, radio frequency identification (RFID) antenna, microelectrode arrays, and some other polymer foil MID was proposed. Based on the in-depth analysis of polymer foil MID's characteristics, polymer foil MID are expected to have a broad application in the field of microfluidic chip.<\/p>","DOI":"10.4018\/ijrat.2014010101","type":"journal-article","created":{"date-parts":[[2015,1,20]],"date-time":"2015-01-20T20:27:40Z","timestamp":1421785660000},"page":"1-18","source":"Crossref","is-referenced-by-count":0,"title":["Development and Application of Molded Interconnect Devices"],"prefix":"10.4018","volume":"2","author":[{"given":"Liangyu","family":"Cui","sequence":"first","affiliation":[{"name":"School of Mechanical Engineering, Tianjin University, Tianjin, China"}]},{"given":"Chengjuan","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering, Tianjin University, Tianjin, China"}]},{"given":"Yanling","family":"Tian","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering, Tianjin University, Tianjin, China"}]},{"given":"Dawei","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering, Tianjin University, Tianjin, China"}]}],"member":"2432","reference":[{"key":"ijrat.2014010101-0","doi-asserted-by":"publisher","DOI":"10.1016\/j.phpro.2010.08.084"},{"key":"ijrat.2014010101-1","doi-asserted-by":"crossref","unstructured":"Bachnak, N. (2012). 3D-MID technology MEMS connectivity at system level. In Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th, 572-576.","DOI":"10.1109\/EPTC.2012.6507147"},{"key":"ijrat.2014010101-2","doi-asserted-by":"crossref","unstructured":"Becker, K. F., Braun, T., & Nuemann, A. (2005). Duromer MID Technology for System-in-Package Generation. IEEE Transactions on Electronics Packaging Manufacrutring, 28, 291 - 296.","DOI":"10.1109\/TEPM.2005.856537"},{"key":"ijrat.2014010101-3","doi-asserted-by":"crossref","unstructured":"Eisenbarth, M., & Feldmann, K. (2002). Press-fit technology for 3-D molded interconnect devices (MID) - A lead-free alternative to solder joints - challenges and solutions concepts. Electronics Manufacturing Technology Symposium, 27th Annual IEEE\/SEMI International.","DOI":"10.1109\/IEMT.2002.1032761"},{"key":"ijrat.2014010101-4","doi-asserted-by":"publisher","DOI":"10.1016\/S0007-8506(07)62153-2"},{"key":"ijrat.2014010101-5","article-title":"Molded interconnection devices (MID) - A new challenge for industrial robots.","author":"K.Feldmann","year":"1994","journal-title":"5th SME World Conference on Robotics Research"},{"key":"ijrat.2014010101-6","doi-asserted-by":"crossref","unstructured":"Feldmann, K., & Krimi, S. (1998). Alternative placement systems for three-dimensional circuit boards. CIRP Annals - Manufacturing Technology, 47(1), 23 - 26.","DOI":"10.1016\/S0007-8506(07)62777-2"},{"key":"ijrat.2014010101-7","doi-asserted-by":"publisher","DOI":"10.1108\/eb037851"},{"key":"ijrat.2014010101-8","unstructured":"Glendennin, P., Annergern, I., & Lett, T., et al. (2011). Molded interconnect Device Technology Development. SIMTech Technical Report."},{"key":"ijrat.2014010101-9","first-page":"1","article-title":"Manufacturing of Molded Interconnect Devices from Prototyping to Mass Production with Laser Direct Structuring.","author":"N.Heineger","year":"2004","journal-title":"International Congress MID 2004"},{"key":"ijrat.2014010101-10","article-title":"Manufacturing of molded interconnect devices from prototyping to mass production with laser direct structuring.","author":"N.Heininger","year":"2004","journal-title":"International Congress MID"},{"key":"ijrat.2014010101-11","article-title":"Laser Supported Activation and Additive Metallization of Thermoplasu tics for 3D-MIDs.","author":"M.Hueske","year":"2001","journal-title":"Proceedings of the 3rd Lane"},{"key":"ijrat.2014010101-12","unstructured":"Islam, A., Hansen, H. N., Tang, P. T., et al. (2009). Two component injection molding for MID fabrication. Annual Technical Conference, ANTEC, Chicago, IL, USA."},{"key":"ijrat.2014010101-13","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-008-1660-9"},{"key":"ijrat.2014010101-14","unstructured":"Islam, A., Mohammad, A., & Hans, N. H., et al. (2008). Micro-MID manufacturing by two-Shot injection molding. On Board Technology, 9(2), 10-13."},{"key":"ijrat.2014010101-15","unstructured":"Khuntontong, P. (2008). Fabrication of polymer micro devices by ultrasonic hot embossing. Doctoral dissertation."},{"key":"ijrat.2014010101-16","doi-asserted-by":"crossref","unstructured":"Khuntontong, P., Blaser, T., & Schomburg, W. K. (2009). Fabrication of Moulded Interconnection Devices by Ultrasonic Hot Embossing on Thin Polymer Films. IEEE Transactions on Electronics Packaging Manufacrutring, 32, 152 - 156.","DOI":"10.1109\/TEPM.2009.2020742"},{"key":"ijrat.2014010101-17","first-page":"578","article-title":"A novel fabrication process for printed antennas integrated in polymer multi-layer car body panels. IEEE In microwave conference","volume":"2009","author":"A.Kilian","year":"2009","journal-title":"EuMC"},{"key":"ijrat.2014010101-18","doi-asserted-by":"publisher","DOI":"10.1109\/EUMC.2008.4751371"},{"key":"ijrat.2014010101-19","unstructured":"Krautheim, T., Poehlau, F., Lorenz, W., et al. (2002). Manual for user and manufacturers: processes, service requirements and material characteristics of molded interconnect devices 3-D MID. Research association molded interconnect devices 3-D e. V. 2nd edition."},{"key":"ijrat.2014010101-20","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2007.01.125"},{"key":"ijrat.2014010101-21","doi-asserted-by":"publisher","DOI":"10.5194\/ars-7-11-2009"},{"key":"ijrat.2014010101-22","doi-asserted-by":"publisher","DOI":"10.3390\/mi2020157"},{"issue":"3","key":"ijrat.2014010101-23","first-page":"30","article-title":"Experiences with peel strength.","volume":"32","author":"R.Wiechemann","year":"2006","journal-title":"Circuit Board"},{"key":"ijrat.2014010101-24","doi-asserted-by":"crossref","unstructured":"Worgull, M. (2009). Hot Embossing: Theory and Technology of Micro replication (pp. 174\u2013175).","DOI":"10.1016\/B978-0-8155-1579-1.50014-8"},{"key":"ijrat.2014010101-25","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-010-3051-2"},{"key":"ijrat.2014010101-26","doi-asserted-by":"publisher","DOI":"10.1080\/0951192X.2011.554871"}],"container-title":["International Journal of Robotics Applications and Technologies"],"original-title":[],"language":"ng","link":[{"URL":"https:\/\/www.igi-global.com\/viewtitle.aspx?TitleId=122260","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,2]],"date-time":"2022-06-02T03:43:09Z","timestamp":1654141389000},"score":1,"resource":{"primary":{"URL":"https:\/\/services.igi-global.com\/resolvedoi\/resolve.aspx?doi=10.4018\/ijrat.2014010101"}},"subtitle":[""],"short-title":[],"issued":{"date-parts":[[2014,1,1]]},"references-count":27,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2014,1]]}},"URL":"https:\/\/doi.org\/10.4018\/ijrat.2014010101","relation":{},"ISSN":["2166-7195","2166-7209"],"issn-type":[{"value":"2166-7195","type":"print"},{"value":"2166-7209","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,1,1]]}}}