{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2023,9,13]],"date-time":"2023-09-13T21:20:46Z","timestamp":1694640046047},"reference-count":16,"publisher":"IGI Global","issue":"2","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,4,1]]},"abstract":"<p>In the integrated circuit (IC) packaging process, including operations of die sawing, die bonding, wire bonding, molding, plating, marking, trim\/form, and inspection. Purposes of packaging include protecting ICs, making ICs easier to handle, and connecting ICs to the circuit outside. The wire bond stations are the bottleneck in the packaging and assemble process where the heat block is the key auxiliary parts in the stations. This research proposes a RFID-enabled Heat Block Management System (RHMS) to accurately control the progress of the IC packaging production line to meet the customer requirements. Our research analyzed all the flows of heat block management operations during before and after introducing RHMS. Hypothesis testing can verify significant difference between two sample sizes. Based on the statistics test of hypothesis, we compared the difference for before and after introducing RHMS. The results show that the RHMS can bring advantage for heat block management in wire bond stations. Moreover, it has clear improvement of saving counting and revising operation time. The contributions of this research are not only a case study but also a direction for applying RFID technology on IC packaging industry.<\/p>","DOI":"10.4018\/japuc.2010040104","type":"journal-article","created":{"date-parts":[[2010,9,7]],"date-time":"2010-09-07T22:15:20Z","timestamp":1283897720000},"page":"57-68","source":"Crossref","is-referenced-by-count":1,"title":["A Study of Applying RFID for Heat Block Management in IC Packaging Factory"],"prefix":"10.4018","volume":"2","author":[{"given":"Wei-Ling","family":"Wang","sequence":"first","affiliation":[{"name":"National Chin-Yi University of Technology, Taiwan"}]},{"given":"Shu-Jen","family":"Wang","sequence":"additional","affiliation":[{"name":"National Chin-Yi University of Technology, Taiwan"}]},{"given":"Chiao-Tzu","family":"Huang","sequence":"additional","affiliation":[{"name":"National Chin-Yi University of Technology, Taiwan"}]}],"member":"2432","reference":[{"key":"japuc.2010040104-0","author":"D. R.Anderson","year":"1996","journal-title":"Statistics for Business and Economics"},{"key":"japuc.2010040104-1","unstructured":"Auto-ID Center. 2002. Technology Guide, Auto-ID Center, www.autoidcenter.org."},{"key":"japuc.2010040104-2","unstructured":"Christian, F., & Matthias, L. 2005. RFID middleware design: addressing application requirements and RFID constraints. ACM International Conference Proceeding Series, 121."},{"key":"japuc.2010040104-3","doi-asserted-by":"publisher","DOI":"10.1016\/S0736-5845(02)00025-X"},{"key":"japuc.2010040104-4","unstructured":"Gildas, A. 2005. Adversarial Model for Radio Frequency Identification,\u201d Swiss Federal Institute of Technology (EPFL), Security and Cryptography Laboratory. http:\/\/eprint.iacr.org\/2005\/049.pdf."},{"key":"japuc.2010040104-5","author":"M. P.Grover","year":"2001","journal-title":"Automation, Production Systems, and Computer Integrated Manufacturing"},{"key":"japuc.2010040104-6","unstructured":"Hsiao, M. C. 2006. A Study of Order Release with Limited Capacity in IC Package Factory. Master\u2019s thesis. Department of Industrial Engineering and Management, Chung Yuan Christian University, Taiwan."},{"key":"japuc.2010040104-7","unstructured":"Li, C. Y. 2006. A Study on the Behavioral Intention of Implementing RFID System-Taiwan Logistics As an Example, Master dissertation, Tatung University, Taipei City."},{"key":"japuc.2010040104-8","unstructured":"Li, S. F. 2000. A Study of Mixed Production in Packaging Firm. Master\u2019s thesis. Department of Industrial Engineering, Feng Chia University, Taiwan."},{"key":"japuc.2010040104-9","author":"S. J.Lin","year":"2007","journal-title":"A Study of Shortening Production Delivery Time\u2014Take an Example of Semiconductor Assembly Factory"},{"key":"japuc.2010040104-10","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijpe.2006.04.002"},{"key":"japuc.2010040104-11","doi-asserted-by":"publisher","DOI":"10.1016\/S0305-0548(01)00051-X"},{"key":"japuc.2010040104-12","doi-asserted-by":"publisher","DOI":"10.1061\/(ASCE)0887-3801(1990)4:3(279)"},{"issue":"12","key":"japuc.2010040104-13","first-page":"33","article-title":"Is RFID ready for the plant floor?","volume":"58","author":"P.Richard","year":"2004","journal-title":"Plant Engineering, Barrington, Illinois"},{"key":"japuc.2010040104-14","doi-asserted-by":"publisher","DOI":"10.1109\/JRPROC.1948.226245"},{"key":"japuc.2010040104-15","doi-asserted-by":"publisher","DOI":"10.1016\/S0166-4972(02)00118-9"}],"container-title":["International Journal of Advanced Pervasive and Ubiquitous Computing"],"original-title":[],"language":"ng","link":[{"URL":"https:\/\/www.igi-global.com\/viewtitle.aspx?TitleId=45136","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,6,2]],"date-time":"2022-06-02T00:31:42Z","timestamp":1654129902000},"score":1,"resource":{"primary":{"URL":"https:\/\/services.igi-global.com\/resolvedoi\/resolve.aspx?doi=10.4018\/japuc.2010040104"}},"subtitle":[""],"short-title":[],"issued":{"date-parts":[[2010,4,1]]},"references-count":16,"journal-issue":{"issue":"2","published-print":{"date-parts":[[2010,4]]}},"URL":"https:\/\/doi.org\/10.4018\/japuc.2010040104","relation":{},"ISSN":["1937-965X","1937-9668"],"issn-type":[{"value":"1937-965X","type":"print"},{"value":"1937-9668","type":"electronic"}],"subject":[],"published":{"date-parts":[[2010,4,1]]}}}