{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,21]],"date-time":"2026-03-21T09:05:28Z","timestamp":1774083928514,"version":"3.50.1"},"reference-count":0,"publisher":"SCITEPRESS - Science and Technology Publications","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026]]},"DOI":"10.5220\/0013856700004052","type":"proceedings-article","created":{"date-parts":[[2026,3,14]],"date-time":"2026-03-14T20:03:22Z","timestamp":1773518602000},"page":"2193-2200","source":"Crossref","is-referenced-by-count":0,"title":["AI-Driven PCB Assembly Defect Detection Using Hybrid Deep Learning Architectures"],"prefix":"10.5220","author":[{"given":"Mustafa","family":"Erten","sequence":"first","affiliation":[{"name":"K\u0131r\u0131kkale University, Electrical and Electronics Engineering, K\u0131r\u0131kkale, Turkey"}]}],"member":"3171","event":{"name":"18th International Conference on Agents and Artificial Intelligence","location":"Marbella, Spain","start":{"date-parts":[[2026,3,5]]},"end":{"date-parts":[[2026,3,8]]}},"container-title":["Proceedings of the 18th International Conference on Agents and Artificial Intelligence"],"original-title":["AI-Driven PCB Assembly Defect Detection Using Hybrid Deep Learning Architectures"],"deposited":{"date-parts":[[2026,3,21]],"date-time":"2026-03-21T08:26:48Z","timestamp":1774081608000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.scitepress.org\/DigitalLibrary\/Link.aspx?doi=10.5220\/0013856700004052"}},"subtitle":[""],"short-title":[],"issued":{"date-parts":[[2026]]},"references-count":0,"URL":"https:\/\/doi.org\/10.5220\/0013856700004052","relation":{},"subject":[],"published":{"date-parts":[[2026]]}}}